Jeon; Byung Kuk
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jeon; Byung Kuk.The latest application filed is for "thermally-conductive polycarbonate resin composition and molded product formed therefrom".
- Jeon; Byung Kuk - Uiwang-si KR
| Patent | Date |
|---|---|
| Thermally-conductive polycarbonate resin composition and molded product formed therefrom Grant 9,862,870 - Kim , et al. January 9, 2 | 2018-01-09 |
| Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom App 20160200957 - KIM; Nam Hyun ; et al. | 2016-07-14 |
| Thermoplastic Resin Composition Having Excellent EMI Shielding Property App 20140264181 - Shin; Chan Gyun ; et al. | 2014-09-18 |
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