JEON; BO MIN
Patent Applications and Registrations
Patent applications and USPTO patent grants for JEON; BO MIN.The latest application filed is for "free-cutting leadless copper alloy with no lead and bismuth".
- JEON; BO MIN - Ulsan KR
- JEON; Bo Min - Daejeon KR
- Jeon; Bo Min - Ulsan-si N/A KR
- Jeon; Bo Min - Nam-gu KR
| Patent | Date |
|---|---|
| Free-cutting Leadless Copper Alloy With No Lead And Bismuth App 20210363613 - JEON; BO MIN ; et al. | 2021-11-25 |
| Copper Alloy Material For Continuous Casting Mold And Process For Producing Same App 20150376755 - KIM; Dae Hyun ; et al. | 2015-12-31 |
| Production method for high purity copper powder using a thermal plasma Grant 9,061,353 - Kim , et al. June 23, 2 | 2015-06-23 |
| Copper alloy with high strength and high conductibility, and method for manufacturing same Grant 8,652,274 - Kim , et al. February 18, 2 | 2014-02-18 |
| Copper Alloy With High Strength And High Conductibility, And Method For Manufacturing Same App 20120312431 - Kim; Dae Hyun ; et al. | 2012-12-13 |
| Copper Alloy Having High Strength And High Conductivity, And Method For Preparing The Same App 20120312430 - Kim; Dae Hyun ; et al. | 2012-12-13 |
| Production Method For High Purity Copper Powder Using A Thermal Plasma App 20120240726 - Kim; Dae Hyun ; et al. | 2012-09-27 |
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