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JENSSEN; Conrad Patent Filings

JENSSEN; Conrad

Patent Applications and Registrations

Patent applications and USPTO patent grants for JENSSEN; Conrad.The latest application filed is for "fluid ejection devices including electrical interconnect elements for fluid ejection dies".

Company Profile
0.3.5
  • JENSSEN; Conrad - Corvallis OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Fluid Ejection Devices Including Electrical Interconnect Elements For Fluid Ejection Dies
App 20210260872 - FULLER; Anthony M. ;   et al.
2021-08-26
Methods and systems for forming slots in a semiconductor substrate
Grant 8,510,948 - Buswell , et al. August 20, 2
2013-08-20
Methods And Systems For Forming Slots In A Semiconductor Substrate
App 20070240309 - Buswell; Shen ;   et al.
2007-10-18
Slotted semiconductor substrate having microelectronics integrated thereon
Grant 6,767,089 - Buswell , et al. July 27, 2
2004-07-27
Methods and systems for forming slots in a semiconductor substrate
App 20030140496 - Buswell, Shen ;   et al.
2003-07-31
Slotted semiconductor substrate having microelectronics integrated thereon
App 20020180860 - Buswell, Shen ;   et al.
2002-12-05
Method Of Forming A Fluid Delivery Slot
App 20020180825 - Buswell, Shen ;   et al.
2002-12-05

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