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Patent applications and USPTO patent grants for Jensen; Ronald James.The latest application filed is for "multi-tiered integrated circuit package".
Patent | Date |
---|---|
Integrated circuit package including a thermally and electrically conductive package lid Grant 8,362,607 - Scheid , et al. January 29, 2 | 2013-01-29 |
Multi-tiered integrated circuit package Grant 8,354,743 - Jensen , et al. January 15, 2 | 2013-01-15 |
Multi-tiered Integrated Circuit Package App 20110180919 - Jensen; Ronald James ;   et al. | 2011-07-28 |
SOI on package hypersensitive sensor Grant 7,868,362 - Randazzo , et al. January 11, 2 | 2011-01-11 |
Integrated circuit package including a thermally and electrically conductive package lid App 20100308453 - Scheid; David ;   et al. | 2010-12-09 |
SOI on Package Hypersensitive Sensor App 20090096113 - Randazzo; Todd Andrew ;   et al. | 2009-04-16 |
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