Jensen; Ronald J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jensen; Ronald J..The latest application filed is for "vertically connected integrated circuits".
- Jensen; Ronald J. - Bloomington MN
- Jensen; Ronald J. - Moraga CA
- Jensen; Ronald J. - Pacifica CA
- Jensen; Ronald J. - Libertyville IL
| Patent | Date |
|---|---|
| Vertically Connected Integrated Circuits App 20150145136 - Jensen; Ronald J. | 2015-05-28 |
| Systems and methods for three dimensional sensors Grant 8,459,112 - Rieger , et al. June 11, 2 | 2013-06-11 |
| Systems And Methods For Three Dimensional Sensors App 20120313193 - Rieger; Ryan W. ; et al. | 2012-12-13 |
| Packaged die heater Grant 7,965,094 - Spielberger , et al. June 21, 2 | 2011-06-21 |
| Method and system for stacking integrated circuits Grant 7,863,720 - Jensen , et al. January 4, 2 | 2011-01-04 |
| Method and system for stacking integrated circuits Grant 7,700,409 - Jensen , et al. April 20, 2 | 2010-04-20 |
| Packaged Die Heater App 20100007367 - Spielberger; Richard ; et al. | 2010-01-14 |
| Integrated circuit package with top-side conduction cooling Grant 7,635,916 - Jensen , et al. December 22, 2 | 2009-12-22 |
| Integrated Circuit Package With Top-Side Conduction Cooling App 20080272482 - Jensen; Ronald J. ; et al. | 2008-11-06 |
| Method and System for Stacking Integrated Circuits App 20070222055 - Jensen; Ronald J. ; et al. | 2007-09-27 |
| Vertical die chip-on-board Grant 7,095,226 - Wan , et al. August 22, 2 | 2006-08-22 |
| Method and system for stacking integrated circuits App 20050258528 - Jensen, Ronald J. ; et al. | 2005-11-24 |
| Vertical die chip-on-board App 20050122100 - Wan, Hong ; et al. | 2005-06-09 |
| Collapsible wheel chair with displaceable seat panels Grant 6,839,918 - Jensen January 11, 2 | 2005-01-11 |
| Stacked ball grid array Grant 6,657,134 - Spielberger , et al. December 2, 2 | 2003-12-02 |
| Ball grid array package App 20030102156 - Spielberger, Richard K. ; et al. | 2003-06-05 |
| Method to permit high temperature assembly processes for magnetically sensitive devices Grant 6,027,948 - Jensen , et al. February 22, 2 | 2000-02-22 |
| Chip stacking and capacitor mounting arrangement including spacers Grant 6,005,778 - Spielberger , et al. December 21, 1 | 1999-12-21 |
| Radiation enhanced chip encapsulant Grant 5,998,867 - Jensen , et al. December 7, 1 | 1999-12-07 |
| Bare die test and burn-in device Grant 5,453,701 - Jensen , et al. September 26, 1 | 1995-09-26 |
| High energy ignitor power circuit Grant 5,049,786 - Gotisar , et al. September 17, 1 | 1991-09-17 |
| Apparatus and method for parts assembly Grant 5,029,095 - Kenik , et al. * July 2, 1 | 1991-07-02 |
| Apparatus and method for parts assembly Grant 4,821,197 - Kenik , et al. April 11, 1 | 1989-04-11 |
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