Jenq; Shrane-Ning

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jenq; Shrane-Ning.The latest application filed is for "tungsten post-cmp cleaning composition".

Company Profile

2.4.7

Jenq; Shrane-Ning - Hsin-chu N/A TW
Jenq; Shrane Ning - Hsinchu County TW
Jenq; Shrane Ning - Yonghe City TW
Jenq; Shrane-Ning - Hsinchu TW
Jenq; Shrane-Ning - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tungsten post-CMP cleaning composition Grant 10,988,718 - Parson , et al. April 27, 2	2021-04-27
Post chemical mechanical polishing formulations and method of use Grant 10,557,107 - Sun , et al. Feb	2020-02-11
Tungsten Post-cmp Cleaning Composition App 20190177671 - PARSON; Thomas ; et al.	2019-06-13
Post Chemical Mechanical Polishing Formulations And Method Of Use App 20180251712 - Sun; Laisheng ; et al.	2018-09-06
Post Chemical Mechanical Polishing Formulations And Method Of Use App 20160340620 - SUN; Laisheng ; et al.	2016-11-24
Aqueous Clean Solution With Low Copper Etch Rate For Organic Residue Removal Improvement App 20150114429 - Jenq; Shrane Ning ; et al.	2015-04-30
Post-cmp Formulation Having Improved Barrier Layer Compatibility And Cleaning Performance App 20150045277 - Liu; Jun ; et al.	2015-02-12
Method for manufacturing copper wires on substrate of flat panel display device Grant 7,393,786 - Jenq , et al. July 1, 2	2008-07-01
Method for manufacturing copper wires on substrate of flat panel display device App 20070128857 - Jenq; Shrane-Ning ; et al.	2007-06-07

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