JENG; Yeau-Ren

Patent Applications and Registrations

Patent applications and USPTO patent grants for JENG; Yeau-Ren.The latest application filed is for "metal three-dimensional printing method with variable sintering thermal energy".

Company Profile

1.17.27

JENG; Yeau-Ren - Tainan City TW
Jeng; Yeau-Ren - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal Three-dimensional Printing Method With Variable Sintering Thermal Energy App 20210187610 - JENG; Yeau-Ren	2021-06-24
Monitoring module for assembly accuracy between two components Grant 10,775,251 - Jeng September 15, 2	2020-09-15
Monitoring Module For Assembly Accuracy Between Two Components App 20190339146 - JENG; Yeau-Ren	2019-11-07
Double nut ball screw capable of sensing preload Grant 9,920,822 - Jeng March 20, 2	2018-03-20
Double Nut Ball Screw Capable Of Sensing Preload App 20170159778 - JENG; Yeau-Ren	2017-06-08
Method of making calcium-fluoride layer formed on an object surface for more wear resistance Grant 9,554,882 - Jeng , et al. January 31, 2	2017-01-31
Ball screw capable of sensing preload Grant 9,464,703 - Jeng , et al. October 11, 2	2016-10-11
Method Of Making Calcium-fluoride Layer Formed On An Object Surface For More Wear Resistance App 20160135937 - JENG; YEAU-REN ; et al.	2016-05-19
Ball screw capable of real-time surveillance and control of preload Grant 9,145,958 - Jeng , et al. September 29, 2	2015-09-29
Ball Screw Capable Of Sensing Push Force In Real Time App 20150184729 - JENG; Yeau-Ren ; et al.	2015-07-02
Band Saw Machine Capable Of Regulating Band-saw Cutting Speed App 20150183037 - JENG; Yeau-Ren ; et al.	2015-07-02
Ball screw capable of thermal dissipation based on thermoelectric cooler Grant 9,046,165 - Jeng , et al. June 2, 2	2015-06-02
Band Saw Machine Capable of Automatically Regulating Cutting Speed App 20150128778 - JENG; Yeau-Ren ; et al.	2015-05-14
Ball Screw Capable Of Thermal Dissipation Based On Thermoelectric Cooler App 20150107389 - JENG; YEAU-REN ; et al.	2015-04-23
Ball Scrw Capable Of Sensing Parallelism In Real Time App 20150096396 - JENG; Yeau-Ren ; et al.	2015-04-09
Ball Screw Capable Of Sensing Torque In Real Time App 20150096397 - JENG; Yeau-Ren ; et al.	2015-04-09
Band Saw Machine Capable Of Regulating Band-saw Tension App 20150027288 - JENG; Yeau-Ren ; et al.	2015-01-29
Ball Screw Capable Of Sensing Preload App 20150020628 - JENG; Yeau-Ren ; et al.	2015-01-22
Band Saw Machine Capable Of Automatically Regulating Cutting Speed App 20150020660 - JENG; Yeau-Ren ; et al.	2015-01-22
Band-saw Cleaning Mechanism For Band Saw Machine App 20150020327 - JENG; Yeau-Ren ; et al.	2015-01-22
Ball Screw Capable Of Real-time Surveillance And Control Of Preload App 20140165759 - JENG; Yeau-Ren ; et al.	2014-06-19
Method for enhancing hardness of nanoimprint mold Grant 8,647,552 - Jeng , et al. February 11, 2	2014-02-11
Ball Screw Assembly Based On Heat-pipe Thermal Dissipation App 20130112025 - Jeng; Yeau-Ren ; et al.	2013-05-09
Method for generating nano patterns upon material surfaces Grant 8,434,221 - Jeng , et al. May 7, 2	2013-05-07
Method For Enhancing Hardness Of Nanoimprint Mold App 20120040090 - JENG; YEAU-REN ; et al.	2012-02-16
Method for predicting the polishing characteristics and life-span of a soft polishing pad App 20110136407 - Jeng; Yeau-Ren ; et al.	2011-06-09
Low-stress polishing device Grant 7,695,351 - Tsai , et al. April 13, 2	2010-04-13
Apparatus For Enhancing Hardness Of Nanoimprint Mold And Method Thereof App 20090285926 - Jeng; Yeau-Ren ; et al.	2009-11-19
Method For Generating Nano Patterns Upon Material Surfaces App 20090272172 - Jeng; Yeau-Ren ; et al.	2009-11-05
Low-stress polishing device App 20080287045 - Tsai; Meng-Shiun ; et al.	2008-11-20
Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process Grant 7,169,019 - Jeng , et al. January 30, 2	2007-01-30
Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process App 20060252352 - Jeng; Yeau-Ren ; et al.	2006-11-09
Wire-bonding Method For Chips With Copper Interconnects By Introducing A Thin Layer App 20050266672 - Jeng, Yeau-Ren ; et al.	2005-12-01
Wire-bonding method for chips with copper interconnects by introducing a thin layer Grant 6,962,864 - Jeng , et al. November 8, 2	2005-11-08
Method of thermosonic wire bonding process for copper connection in a chip Grant 6,886,735 - Jeng , et al. May 3, 2	2005-05-03
Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material App 20040259481 - Pan, Wen-Chueh ; et al.	2004-12-23
Bi-direction pumping droplet mist ejection apparatus Grant 6,764,023 - Peng , et al. July 20, 2	2004-07-20
Method of thermosonic wire bonding process for copper connection in a chip App 20040108362 - Jeng, Yeau-Ren ; et al.	2004-06-10
Bi-direction pumping droplet mist ejection apparatus App 20040069864 - Peng, Yu-Yin ; et al.	2004-04-15
Preloading regulating mechanism for rolling bearings Grant 6,158,898 - Jeng , et al. December 12, 2	2000-12-12
Test apparatus for lubrication performance of rolling bearings Grant 5,959,189 - Jeng , et al. September 28, 1	1999-09-28

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