Jeng; Kevin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeng; Kevin.The latest application filed is for "ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same".

Company Profile

0.4.4

Jeng; Kevin - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same Grant 7,960,831 - Hua , et al. June 14, 2	2011-06-14
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same Grant 7,314,819 - Hua , et al. January 1, 2	2008-01-01
Ball-limiting Metallurgies, Solder Bump Compositions Used Therewith, Packages Assembled Thereby, And Methods Of Assembling Same App 20070284741 - Hua; Fay ; et al.	2007-12-13
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same App 20070004086 - Hua; Fay ; et al.	2007-01-04
Forming a cap above a metal layer App 20060180945 - Seshan; Krishna ; et al.	2006-08-17
Forming a cap above a metal layer Grant 7,056,817 - Seshan , et al. June 6, 2	2006-06-06
Forming a cap above a metal layer App 20040094836 - Seshan, Krishna ; et al.	2004-05-20
Wire bonding surface and bonding method Grant 6,265,300 - Bhansali , et al. July 24, 2	2001-07-24

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