loadpatents
Patent applications and USPTO patent grants for Jeng; Jung-Chi.The latest application filed is for "finfet mos capacitor".
Patent | Date |
---|---|
Fabrication of long gate devices Grant 11,444,175 - Yang , et al. September 13, 2 | 2022-09-13 |
Finfet Mos Capacitor App 20220238729 - Yang; Sung-Hsin ;   et al. | 2022-07-28 |
Semiconductor Device and Method App 20220238521 - Yang; Sung-Hsin ;   et al. | 2022-07-28 |
High Voltage Device App 20220068721 - Yang; Sung-Hsin ;   et al. | 2022-03-03 |
Fabrication of Long Gate Devices App 20220068719 - Yang; Sung-Hsin ;   et al. | 2022-03-03 |
Source/drain Epitaxial Structures For High Voltage Transistors App 20210343596 - YANG; Sung-Hsin ;   et al. | 2021-11-04 |
Input/output Devices App 20210335784 - Yang; Sung-Hsin ;   et al. | 2021-10-28 |
High Voltage Devices App 20210202321 - Yang; Sung-Hsin ;   et al. | 2021-07-01 |
Method for forming semiconductor device structure with conductive line Grant 10,879,186 - Jeng , et al. December 29, 2 | 2020-12-29 |
Method For Forming Semiconductor Device Structure With Conductive Line App 20200402914 - JENG; Chi-Cherng ;   et al. | 2020-12-24 |
Method Of Forming Semiconductor Device With Gate App 20200295188 - JENG; Jung-Chi ;   et al. | 2020-09-17 |
Method for forming semiconductor device structure with conductive line Grant 10,770,401 - Jeng , et al. Sep | 2020-09-08 |
Method of forming semiconductor device with gate Grant 10,680,103 - Jeng , et al. | 2020-06-09 |
Method For Forming Semiconductor Device Structure With Conductive Line App 20200118932 - JENG; Chi-Cherng ;   et al. | 2020-04-16 |
Fabrication of semiconductor device Grant 10,516,048 - Chen , et al. Dec | 2019-12-24 |
Method for forming semiconductor device structure with conductive line Grant 10,510,671 - Jeng , et al. Dec | 2019-12-17 |
Method For Forming Semiconductor Device Structure With Conductive Line App 20190139895 - JENG; Chi-Cherng ;   et al. | 2019-05-09 |
Semiconductor device and manufacturing method thereof Grant 10,090,392 - Chen , et al. October 2, 2 | 2018-10-02 |
Fabrication Of Semiconductor Device App 20180061987 - CHEN; I-Chih ;   et al. | 2018-03-01 |
Semiconductor device and manufacturing method thereof Grant 9,865,731 - Chen , et al. January 9, 2 | 2018-01-09 |
Method Of Forming Semiconductor Device With Gate App 20170338342 - JENG; Jung-Chi ;   et al. | 2017-11-23 |
Semiconductor device and fabricating method thereof Grant 9,812,569 - Chen , et al. November 7, 2 | 2017-11-07 |
Mechanism for forming semiconductor device with gate Grant 9,728,637 - Jeng , et al. August 8, 2 | 2017-08-08 |
Bonding pad structure with dense via array Grant 9,711,468 - Tsai , et al. July 18, 2 | 2017-07-18 |
Mechanism for forming gate Grant 9,281,215 - Jeng , et al. March 8, 2 | 2016-03-08 |
Bonding Pad Structure With Dense Via Array App 20150214165 - TSAI; Tsung-Han ;   et al. | 2015-07-30 |
Semiconductor Device And Manufacturing Method Thereof App 20150206945 - CHEN; I-CHIH ;   et al. | 2015-07-23 |
Semiconductor Device And Fabricating Method Thereof App 20150200299 - CHEN; I-Chih ;   et al. | 2015-07-16 |
Bonding pad structure with dense via array Grant 9,041,204 - Tsai , et al. May 26, 2 | 2015-05-26 |
Semiconductor Device And Manufacturing Method Thereof App 20150137247 - CHEN; I-CHIH ;   et al. | 2015-05-21 |
Mechanism For Forming Semiconductor Device With Gate App 20150129987 - JENG; Jung-Chi ;   et al. | 2015-05-14 |
Mechanism For Forming Gate App 20150129940 - JENG; Jung-Chi ;   et al. | 2015-05-14 |
Method for increasing photodiode full well capacity Grant 8,951,826 - Jeng , et al. February 10, 2 | 2015-02-10 |
Bonding Pad Structure With Dense Via Array App 20130256893 - TSAI; Tsung-Han ;   et al. | 2013-10-03 |
Method for Increasing Photodiode Full Well Capacity App 20130193539 - Jeng; Jung-Chi ;   et al. | 2013-08-01 |
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