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Patent applications and USPTO patent grants for Jeng; Jian-Dih.The latest application filed is for "electronic package and heat dissipation structure thereof".
Patent | Date |
---|---|
Electronic Package And Heat Dissipation Structure Thereof App 20220189849 - Jeng; Jian-Dih ;   et al. | 2022-06-16 |
Oxygen generator Grant 10,981,787 - Jeng April 20, 2 | 2021-04-20 |
Oxygen Generator App 20190002280 - Jeng; Jian-Dih | 2019-01-03 |
Oxygen Generation Apparatus App 20170340907 - Jeng; Jian-Dih | 2017-11-30 |
Simplified Fluid Dynamic Bearing Design App 20080205804 - Jeng; Jian-Dih | 2008-08-28 |
Pressing Method for Sealing Heat Pipe App 20080141872 - Jeng; Jian-Dih | 2008-06-19 |
Heat Pipe with Advanced Capillary Structure App 20080142196 - Jeng; Jian-Dih | 2008-06-19 |
Flexible Heat Pipe App 20080066891 - Jeng; Jian-Dih | 2008-03-20 |
Panel-type radiating system App 20060254754 - Jeng; Jian-Dih | 2006-11-16 |
Heat sink bonded to a die paddle having at least one aperture Grant 5,783,860 - Jeng , et al. July 21, 1 | 1998-07-21 |
Fanless convection cooling design for personal computers Grant 5,243,493 - Jeng , et al. September 7, 1 | 1993-09-07 |
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