Jeng; Jhy-Long
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jeng; Jhy-Long.The latest application filed is for "polyimide copolymers and method for fabricating patterned metal oxide layers".
- Jeng; Jhy-Long - Junghe TW
- JENG; Jhy-Long - Junghe City TW
- Jeng; Jhy-Long - Taipei TW
| Patent | Date |
|---|---|
| Polyimide copolymers and method for fabricating patterned metal oxide layers Grant 9,169,357 - Jeng , et al. October 27, 2 | 2015-10-27 |
| Thermally curable solder resist composition Grant 8,420,745 - Jeng , et al. April 16, 2 | 2013-04-16 |
| Polyimide Copolymers And Method For Fabricating Patterned Metal Oxide Layers App 20130029049 - JENG; Jhy-Long ; et al. | 2013-01-31 |
| Thermally Curable Solder Resist Composition App 20110306703 - JENG; Jhy-Long ; et al. | 2011-12-15 |
| Thermally Curable Solder Resist Composition App 20100167205 - JENG; Jhy-Long ; et al. | 2010-07-01 |
| Positive working photosensitive composition, article and process for forming a relief pattern Grant 6,670,090 - Hsu , et al. December 30, 2 | 2003-12-30 |
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