Jen; Wei-Lun Kane

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jen; Wei-Lun Kane.The latest application filed is for "device and method of very high density routing used with embedded multi-die interconnect bridge".

Company Profile

8.10.15

Jen; Wei-Lun Kane - Chandler AZ
Jen; Wei-Lun Kane - Sugarland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device And Method Of Very High Density Routing Used With Embedded Multi-die Interconnect Bridge App 20210280517 - May; Robert Alan ; et al.	2021-09-09
Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate Grant 10,978,399 - Darmawikarta , et al. April 13, 2	2021-04-13
Asymmetric electronic substrate and method of manufacture Grant 10,980,129 - Chavali , et al. April 13, 2	2021-04-13
Semiconductor device including silane based adhesion promoter and method of making Grant 10,916,486 - Brown , et al. February 9, 2	2021-02-09
High Density Organic Bridge Device And Method App 20200294924 - Roy; Mihir K. ; et al.	2020-09-17
Asymmetric Electronic Substrate And Method Of Manufacture App 20200221577 - Chavali; Sri Chaitra Jyotsna ; et al.	2020-07-09
High density organic bridge device and method Grant 10,672,713 - Roy , et al.	2020-06-02
Asymmetric electronic substrate and method of manufacture Grant 10,624,213 - Chavali , et al.	2020-04-14
Die Interconnect Substrate, an Electrical Device, and a Method for Forming a Die Interconnect Substrate App 20200051915 - Darmawikarta; Kristof ; et al.	2020-02-13
Semiconductor Device And Method Of Making App 20190355642 - Brown; Andrew J. ; et al.	2019-11-21
High Density Organic Bridge Device And Method App 20190019755 - Roy; Mihir K. ; et al.	2019-01-17
High density organic bridge device and method Grant 10,103,105 - Roy , et al. October 16, 2	2018-10-16
Multilayer substrate for semiconductor packaging Grant 9,788,416 - Jen , et al. October 10, 2	2017-10-10
High Density Organic Bridge Device And Method App 20170125349 - Roy; Mihir K. ; et al.	2017-05-04
Electronic package with narrow-factor via including finish layer Grant 9,603,247 - Swaminathan , et al. March 21, 2	2017-03-21
High density organic bridge device and method Grant 9,548,264 - Roy , et al. January 17, 2	2017-01-17
Multilayer Substrate For Semiconductor Packaging App 20160329274 - Jen; Wei-Lun Kane ; et al.	2016-11-10
High Density Organic Bridge Device And Method App 20160133552 - Roy; Mihir K. ; et al.	2016-05-12
Electronic Package With Narrow-factor Via Including Finish Layer App 20160044786 - Swaminathan; Rajasekaran ; et al.	2016-02-11
High density organic bridge device and method Grant 9,236,366 - Roy , et al. January 12, 2	2016-01-12
Novel Dual-Tone Resist Formulations And Methods App 20140342291 - Willson; C. Grant ; et al.	2014-11-20
High Density Organic Bridge Device And Method App 20140174807 - Roy; Mihir K. ; et al.	2014-06-26
Novel Dual-tone Resist Formulations And Methods App 20110262860 - Willson; C. Grant ; et al.	2011-10-27

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