Jen; Keh-Chee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jen; Keh-Chee.The latest application filed is for "bit error rate based system and method for optimizing communication system performance".

Company Profile

0.6.5

Jen; Keh-Chee - Las Flores CA
Jen; Keh-Chee - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bit error rate based system and method for optimizing communication system performance Grant 7,840,134 - Fan , et al. November 23, 2	2010-11-23
Bit Error Rate Based System And Method For Optimizing Communication System Performance App 20090269056 - Fan; Nong ; et al.	2009-10-29
Bit error rate based system and method for optimizing communication system performance Grant 7,548,692 - Fan , et al. June 16, 2	2009-06-16
System and method for performing on-chip synchronization of system signals utilizing off-chip harmonic signal Grant 7,463,706 - Sefidvash , et al. December 9, 2	2008-12-09
System And Method For Performing On-chip Synchronization Of System Signals Utilizing Off-chip Harmonic Signal App 20070258551 - Sefidvash; Khorvish ; et al.	2007-11-08
System and method for performing on-chip synchronization of system signals utilizing off-chip harmonic signal Grant 7,286,622 - Sefidvash , et al. October 23, 2	2007-10-23
Bit Error Rate Based System And Method For Optimizing Communication System Performance App 20070092261 - Fan; Nong ; et al.	2007-04-26
Bit error rate based system and method for optimizing communication system performance Grant 7,151,894 - Fan , et al. December 19, 2	2006-12-19
System and method for performing on-chip synchronization of system signals utilizing off-chip harmonic signal App 20040028156 - Sefidvash, Khorvish ; et al.	2004-02-12
Bit error rate based system and method for optimizing communication system performance App 20040028404 - Fan, Nong ; et al.	2004-02-12
Method for determining interconnection resistance of wire leads in electronic packages Grant 5,786,700 - Jen , et al. July 28, 1	1998-07-28

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