Jedlicka; Josef E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jedlicka; Josef E..The latest application filed is for "in-line image sensor in combination with linear variable filter based spectrophotometer".

Company Profile

0.16.7

Jedlicka; Josef E. - Denver CO US
Jedlicka; Josef E. - Rochester NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
In-line image sensor in combination with linear variable filter based spectrophotometer Grant 8,368,002 - Hosier , et al. February 5, 2	2013-02-05
In-line Image Sensor In Combination With Linear Variable Filter Based Spectrophotometer App 20110089316 - HOSIER; Paul A. ; et al.	2011-04-21
Color filter configuration for a silicon wafer to be diced into photosensitive chips Grant 6,998,595 - Hosier , et al. February 14, 2	2006-02-14
Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon Grant 6,955,989 - Perregaux , et al. October 18, 2	2005-10-18
Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon App 20050221585 - Perregaux, Alain E. ; et al.	2005-10-06
Photosensitive imaging apparatus sensitive to orange light Grant 6,927,381 - Hosier , et al. August 9, 2	2005-08-09
Color filter configuration for a silicon wafer to be diced into photosensitive chips App 20040164229 - Hosier, Paul A. ; et al.	2004-08-26
Infrared correction in color scanners Grant 6,768,565 - Perregaux , et al. July 27, 2	2004-07-27
Photosensitive imaging apparatus sensitive to orange light App 20040046105 - Hosier, Paul A. ; et al.	2004-03-11
Photosensitive imaging apparatus sensitive to orange light Grant 6,646,248 - Hosier , et al. November 11, 2	2003-11-11
Use of a U-groove as an alternative to using a V-groove for protecting silicon against dicing induced damage App 20030194864 - Perregaux, Alain E. ; et al.	2003-10-16
Photosensitive imaging apparatus sensitive to orange light App 20020153471 - Hosier, Paul A. ; et al.	2002-10-24
Color filter configuration for a silicon wafer to be diced into photosensitive chips App 20020125408 - Hosier, Paul A. ; et al.	2002-09-12
Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same Grant 6,255,133 - Ormond , et al. July 3, 2	2001-07-03
Sensor cover glass with infrared filter Grant 6,252,220 - Jedlicka , et al. June 26, 2	2001-06-26
Filter architecture for a photosensitive chip Grant 5,604,362 - Jedlicka , et al. February 18, 1	1997-02-18
Precision dicing of silicon chips from a wafer Grant 5,521,125 - Ormond , et al. May 28, 1	1996-05-28
Process for separating image sensor dies and the like from a wafer that minimizes silicon waste Grant 5,128,282 - Ormond , et al. July 7, 1	1992-07-07
Color array for use in fabricating full width arrays Grant 5,031,032 - Perregaux , et al. July 9, 1	1991-07-09
Process for assembling smaller arrays together to form a longer array Grant 4,954,197 - Jedlicka , et al. September 4, 1	1990-09-04
Method of fabricating image sensor dies for use in assembling arrays Grant 4,814,296 - Jedlicka , et al. March 21, 1	1989-03-21
Conductive brush paper position sensor Grant 4,641,949 - Wallace , et al. February 10, 1	1987-02-10

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