Jaynes; Paul B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jaynes; Paul B..The latest application filed is for "non-planar circuit board and a method for fabricating the same".

Company Profile

0.5.5

Jaynes; Paul B. - Indialantic FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating non-planar circuit board Grant 8,161,633 - Shacklette , et al. April 24, 2	2012-04-24
Method and apparatus for sealing flex circuits made with an LCP substrate Grant 7,768,619 - Smith , et al. August 3, 2	2010-08-03
Apparatus for sealing flex circuits having heat sensitive circuit elements Grant 7,591,924 - Smith , et al. September 22, 2	2009-09-22
Non-Planar Circuit Board and a Method for Fabricating the Same App 20080244898 - Shacklette; Lawrence W. ; et al.	2008-10-09
Method of constructing a structural circuit Grant 7,343,675 - Smith , et al. March 18, 2	2008-03-18
Method And Apparatus For Sealing Flex Circuits Having Heat Sensitive Circuit Elements App 20060286189 - Smith; C.W. Sinjin ; et al.	2006-12-21
Method and apparatus for sealing flex circuits having heat sensitive circuit elements Grant 7,128,801 - Smith , et al. October 31, 2	2006-10-31
Method and apparatus for sealing flex circuits having heat sensitive circuit elements App 20060169405 - Smith; C.W. Sinjin ; et al.	2006-08-03
Multi-functional structural circuits App 20060104037 - Smith; C.W. Sinjin ; et al.	2006-05-18
Method and apparatus for sealing flex circuits made with an LCP substrate App 20060028612 - Smith; C.W. Sinjin ; et al.	2006-02-09

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