Jaynes; Paul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jaynes; Paul.The latest application filed is for "electronic and optoelectronic component packaging technique".
- Jaynes; Paul - Attleboro MA
| Patent | Date |
|---|---|
| Chip package sealing method Grant 7,972,901 - Farrell , et al. July 5, 2 | 2011-07-05 |
| Electronic and optoelectronic component packaging technique Grant 7,476,566 - Farrell , et al. January 13, 2 | 2009-01-13 |
| Chip package sealing method Grant 6,977,187 - Farrell , et al. December 20, 2 | 2005-12-20 |
| Electronic and optoelectronic component packaging technique App 20050260797 - Farrell, Brian ; et al. | 2005-11-24 |
| Electronic and optoelectronic component packaging technique Grant 6,952,046 - Farrell , et al. October 4, 2 | 2005-10-04 |
| Chip package sealing method App 20050189332 - Farrell, Brian ; et al. | 2005-09-01 |
| Chip package sealing method App 20040010910 - Farrell, Brian ; et al. | 2004-01-22 |
| Electronic and optoelectronic component packaging technique App 20040012083 - Farrell, Brian ; et al. | 2004-01-22 |
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