Jayaraman; Saikumar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jayaraman; Saikumar.The latest application filed is for "micro socket electrical couplings for dies".

Company Profile

3.73.75

Jayaraman; Saikumar - Chandler AZ
JAYARAMAN; Saikumar - Hillsboro OR
Jayaraman; Saikumar - Twinsburg OH
Jayaraman; Saikumar - Cuyahoga Falls OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Architecture and processes to enable high capacity memory packages through memory die stacking Grant 11,456,281 - Li , et al. September 27, 2	2022-09-27
Micro Socket Electrical Couplings For Dies App 20220200183 - NEKKANTY; Srikant ; et al.	2022-06-23
Systems And Methods For Device Authentication In Supply Chain App 20220116206 - KEHLET; David ; et al.	2022-04-14
Architecture And Processes To Enable High Capacity Memory Packages Through Memory Die Stacking App 20200105719 - LI; Yi ; et al.	2020-04-02
Thermally-optimized Tunable Stack In Cavity Package-on-package App 20200043894 - VAKANAS; George ; et al.	2020-02-06
Pillar based socket Grant 10,522,450 - Murtagian , et al. Dec	2019-12-31
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 10,115,606 - Bai , et al. October 30, 2	2018-10-30
Forming A Stress Compensation Layer And Structures Formed Thereby App 20180182697 - SUH; Daewoong ; et al.	2018-06-28
Forming a stress compensation layer and structures formed thereby Grant 9,929,080 - Suh , et al. March 27, 2	2018-03-27
Integrated Circuit Package Stack App 20180005989 - Jayaraman; Saikumar ; et al.	2018-01-04
Integrated circuit package stack Grant 9,859,253 - Jayaraman , et al. January 2, 2	2018-01-02
Integrated WLUF and SOD process Grant 9,728,515 - Mahmud , et al. August 8, 2	2017-08-08
Solder-on-die using water-soluble resist system and method Grant 9,659,889 - Oka , et al. May 23, 2	2017-05-23
Thermoset polymides for microelectronic applications Grant 9,646,903 - Lehman, Jr. , et al. May 9, 2	2017-05-09
Dry-removable Protective Coatings App 20170033069 - Oka; Mihir A. ; et al.	2017-02-02
Dry-removable protective coatings Grant 9,472,517 - Oka , et al. October 18, 2	2016-10-18
Integrated Wluf And Sod Process App 20160247774 - Mahmud; Rubayat ; et al.	2016-08-25
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20160240395 - Bai; Yiqun ; et al.	2016-08-18
Integrated WLUF and SOD process Grant 9,349,698 - Mahmud , et al. May 24, 2	2016-05-24
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 9,330,993 - Bai , et al. May 3, 2	2016-05-03
Polymer matrices for polymer solder hybrid materials Grant 9,247,686 - Jayaraman , et al. January 26, 2	2016-01-26
Dry-removable Protective Coatings App 20150270235 - Oka; Mihir A. ; et al.	2015-09-24
Solder-on-die Using Water-soluble Resist System And Method App 20150179595 - Oka; Mihir ; et al.	2015-06-25
Polymer Matrices For Polymer Solder Hybrid Materials App 20140182763 - JAYARAMAN; Saikumar ; et al.	2014-07-03
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20140175634 - Bai; Yiqun ; et al.	2014-06-26
Thermoset Polymides For Microelectronic Applications App 20140148557 - Lehman, JR.; Stephen E. ; et al.	2014-05-29
Polymer matrices for polymer solder hybrid materials Grant 8,703,286 - Jayaraman , et al. April 22, 2	2014-04-22
Thermoset polyimides for microelectronic applications Grant 8,643,199 - Lehman, Jr. , et al. February 4, 2	2014-02-04
Integrated Wluf And Sod Process App 20140001631 - Mahmud; Rubayat ; et al.	2014-01-02
Photosensitive compositions based on polycyclic polymers Grant 8,114,948 - Elce , et al. February 14, 2	2012-02-14
Method of fabricating a capillary-flow underfill compositions Grant 8,093,105 - Manepalli , et al. January 10, 2	2012-01-10
Directly photodefinable polymer compositions and methods thereof Grant 8,053,515 - Elce , et al. November 8, 2	2011-11-08
Capillary-flow Underfill Compositions, Packages Containing Same, And Systems Containing Same App 20110223722 - Manepalli; Rahul N. ; et al.	2011-09-15
Polymer Matrices For Polymer Solder Hybrid Materials App 20110194254 - Jayaraman; Saikumar ; et al.	2011-08-11
Polymer matrices for polymer solder hybrid materials Grant 7,967,942 - Jayaraman , et al. June 28, 2	2011-06-28
Capillary-flow underfill compositions, packages containing same, and systems containing same Grant 7,948,090 - Manepalli , et al. May 24, 2	2011-05-24
Polymerized cycloolefins using transition metal catalyst and end products thereof Grant 7,910,674 - Rhodes , et al. March 22, 2	2011-03-22
Polycyclic polymers containing pendant ion conducting moieties Grant 7,851,575 - Ravikiran , et al. December 14, 2	2010-12-14
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Grant 7,846,778 - Rumer , et al. December 7, 2	2010-12-07
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Grant 7,776,657 - Dani , et al. August 17, 2	2010-08-17
Low temperature bumping process Grant 7,718,216 - Sterrett , et al. May 18, 2	2010-05-18
Thermoset Polyimides For Microelectronic Applications App 20090146289 - Lehman, JR.; Stephen E. ; et al.	2009-06-11
Thermoset polyimides for microelectronic applications Grant 7,534,649 - Lehman, Jr. , et al. May 19, 2	2009-05-19
Low temperature bumping process Grant 7,521,115 - Sterrett , et al. April 21, 2	2009-04-21
Underfill and mold compounds including siloxane-based aromatic diamines Grant 7,479,449 - Jayaraman January 20, 2	2009-01-20
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Grant 7,473,995 - Rumer , et al. January 6, 2	2009-01-06
Polycyclic polymers containing pendant ion conducting moieties App 20080242750 - Ravikiran; R. ; et al.	2008-10-02
Underfill of resin and sulfonic acid-releasing thermally cleavable compound Grant 7,423,096 - Jayaraman September 9, 2	2008-09-09
Directly Photodefinable Polymer Compositions And Methods Thereof App 20080194740 - Elce; Edmund ; et al.	2008-08-14
Capillary-flow Underfill Compositions, Packages Containing Same, And Systems Containing Same App 20080150170 - Manepalli; Rahul N. ; et al.	2008-06-26
Silicone-based cyanate-ester cross-linkable die attach adhesive Grant 7,387,841 - Jayaraman June 17, 2	2008-06-17
Directly photodefinable polymer compositions and methods thereof Grant 7,378,456 - Elce , et al. May 27, 2	2008-05-27
Chip Package Thermal Interface Materials With Dielectric Obstructions For Body-biasing, Methods Of Using Same, And Systems Containing Same App 20080064144 - Dani; Ashay A. ; et al.	2008-03-13
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Grant 7,332,807 - Dani , et al. February 19, 2	2008-02-19
Underfill And Mold Compounds Including Siloxane-based Aromatic Diamines App 20080009130 - Jayaraman; Saikumar	2008-01-10
Wafer-level processing of chip-packaging compositions including bis-maleimides Grant 7,314,778 - Jayaraman , et al. January 1, 2	2008-01-01
Thermal interface material and electronic assembly having such a thermal interface material Grant 7,311,967 - Dani , et al. December 25, 2	2007-12-25
Polycyclic polymers containing pendant ion conducting moieties Grant 7,312,292 - Ravikiran , et al. December 25, 2	2007-12-25
Phase change material containing fusible particles as thermally conductive filler App 20070287005 - Jayaraman; Saikumar ; et al.	2007-12-13
Thermoset polyimides for microelectronic applications App 20070262421 - Lehman; Stephen E. JR. ; et al.	2007-11-15
Underfill and mold compounds including siloxane-based aromatic diamines Grant 7,294,915 - Jayaraman November 13, 2	2007-11-13
Phase change material containing fusible particles as thermally conductive filler Grant 7,294,394 - Jayaraman , et al. November 13, 2	2007-11-13
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same Grant 7,291,548 - Suh , et al. November 6, 2	2007-11-06
Polymer matrices for polymer solder hybrid materials App 20070251639 - Jayaraman; Saikumar ; et al.	2007-11-01
Stress-relief Layers And Stress-compensation Collars With Low-temperature Solders For Board-level Joints, And Processes Of Making Same App 20070190772 - Suh; Daewoong ; et al.	2007-08-16
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same Grant 7,253,088 - Suh , et al. August 7, 2	2007-08-07
Polymer matrices for polymer solder hybrid materials Grant 7,252,877 - Jayaraman , et al. August 7, 2	2007-08-07
Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same Grant 7,244,634 - Suh , et al. July 17, 2	2007-07-17
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same App 20070158823 - Dani; Ashay A. ; et al.	2007-07-12
Chip package dielectric sheet for body-biasing App 20070152325 - Dani; Ashay A. ; et al.	2007-07-05
Wafer-level processing of chip-packaging compositions including bis-maleimides App 20070155047 - Jayaraman; Saikumar ; et al.	2007-07-05
Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same App 20070152311 - Jayaraman; Saikumar ; et al.	2007-07-05
Low Temperature Bumping Process App 20070148360 - Sterrett; Terry Lee ; et al.	2007-06-28
Silicone-based cyanate-ester cross-linkable die attach adhesive Grant 7,211,638 - Jayaraman May 1, 2	2007-05-01
Anhydride polymers for use as curing agents in epoxy resin-based underfill material Grant 7,202,304 - Jayaraman , et al. April 10, 2	2007-04-10
Flip-chip system and method of making same Grant 7,183,139 - Jayaraman , et al. February 27, 2	2007-02-27
Underfill and mold compounds including siloxane-based aromatic diamines Grant 7,084,492 - Jayaraman August 1, 2	2006-08-01
Photosensitive compositions based on polycyclic polymers App 20060167197 - Elce; Edmund ; et al.	2006-07-27
Anhydride polymers for use as curing agents in epoxy resin-based underfill material App 20060154080 - Jayaraman; Saikumar ; et al.	2006-07-13
Forming a stress compensation layer and structures formed thereby App 20060105497 - Suh; Daewoong ; et al.	2006-05-18
Anhydride polymers for use as curing agents in epoxy resin-based underfill material Grant 7,041,736 - Jayaraman , et al. May 9, 2	2006-05-09
Thermally activated fluxes for no-flow underfill compositions, packages made therewith, and methods of assembling same App 20060073344 - Jayaraman; Saikumar	2006-04-06
Photosensitive compositions based on polycyclic polymers Grant 7,022,790 - Elce , et al. April 4, 2	2006-04-04
Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same App 20060068579 - Suh; Daewoong ; et al.	2006-03-30
Underfill and mold compounds including siloxane-based aromatic diamines App 20060043614 - Jayaraman; Saikumar	2006-03-02
Thermoelectric cooling for microelectronic packages and dice Grant 6,981,380 - Chrysler , et al. January 3, 2	2006-01-03
Jet-dispensed stress relief layer in contact arrays, and processes of making same App 20050224951 - Suh, Daewoong ; et al.	2005-10-13
Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same App 20050221534 - Suh, Daewoong ; et al.	2005-10-06
Phase change material containing fusible particles as thermally conductive filler App 20050214523 - Jayaraman, Saikumar ; et al.	2005-09-29
Microelectronic packaging and methods for thermally protecting package interconnects and components App 20050214977 - Rumer, Christopher L. ; et al.	2005-09-29
Directly photodefinable polymer compositions and methods thereof App 20050186502 - Elce, Edmund ; et al.	2005-08-25
Phase change material containing fusible particles as thermally conductive filler Grant 6,926,955 - Jayaraman , et al. August 9, 2	2005-08-09
Silicone-based cyanate-ester cross-linkable die attach adhesive App 20050159573 - Jayaraman, Saikumar	2005-07-21
Curing processes for substrate imprinting, structures made thereby, and polymers used therefor App 20050142345 - Jayaraman, Saikumar	2005-06-30
Microelectronic packaging and methods for thermally protecting package interconnects and components Grant 6,911,726 - Rumer , et al. June 28, 2	2005-06-28
Polymerized cycloolefins using transition metal catalyst and end products thereof Grant 6,903,171 - Rhodes , et al. June 7, 2	2005-06-07
Stress compensation layer systems for improved second level solder joint reliability App 20050068757 - Jayaraman, Saikumar ; et al.	2005-03-31
Polycyclic polymers containing pendant ion conducting moieties App 20050019638 - Ravikiran, R. ; et al.	2005-01-27
Silicone-based cyanate-ester cross-linkable die attach adhesive App 20050014920 - Jayaraman, Saikumar	2005-01-20
Underfill and mold compounds including siloxane-based aromatic diamines App 20040262750 - Jayaraman, Saikumar	2004-12-30
Flip-chip system and method of making same App 20040185603 - Jayaraman, Saikumar ; et al.	2004-09-23
Modified polycyclic polymers Grant 6,794,459 - Jayaraman , et al. September 21, 2	2004-09-21
Photoresist compositions comprising polycyclic polymers with acid labile pendant groups Grant 6,790,579 - Goodall , et al. September 14, 2	2004-09-14
Polymer matrices for polymer solder hybrid materials App 20040151885 - Jayaraman, Saikumar ; et al.	2004-08-05
Thermoelectric cooling for microelectronic packages and dice App 20040118129 - Chrysler, Gregory M. ; et al.	2004-06-24
Low temperature bumping process App 20040115408 - Sterrett, Terry Lee ; et al.	2004-06-17
Anhydride polymers for use as curing agents in epoxy resin-based underfill material App 20040106770 - Jayaraman, Saikumar ; et al.	2004-06-03
Flip-chip system and method of making same Grant 6,724,091 - Jayaraman , et al. April 20, 2	2004-04-20
Photoresist compositions comprising polycyclic polymers with acid labile pendant groups Grant 6,723,486 - Goodall , et al. April 20, 2	2004-04-20
Polymerized cycloolefins using transition metal catalyst and end products thereof App 20040048994 - Rhodes, Larry Funderburk ; et al.	2004-03-11
Photosensitive compositions based on polycyclic polymers App 20040039153 - Elce, Edmund ; et al.	2004-02-26
Microelectronic packaging and methods for thermally protecting package interconnects and components App 20030227066 - Rumer, Christopher L. ; et al.	2003-12-11
Processes for making polymers containing pendant cyclic anhydride groups Grant 6,649,714 - Jayaraman , et al. November 18, 2	2003-11-18
Processes for making polymers containing pendant cyclic anhydride groups App 20030195298 - Jayaraman, Saikumar ; et al.	2003-10-16
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly App 20030178730 - Rumer, Christopher L. ; et al.	2003-09-25
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly App 20030178720 - Rumer, Christopher L. ; et al.	2003-09-25
Polymerized cycloolefins using transition metal catalyst and end products thereof App 20030181607 - Rhodes, Larry Funderburk ; et al.	2003-09-25
Anhydride polymers for use as curing agents in epoxy resin-based underfill material Grant 6,620,512 - Jayaraman , et al. September 16, 2	2003-09-16
Phase change material containing fusible particles as thermally conductive filler App 20030153667 - Jayaraman, Saikumar ; et al.	2003-08-14
Anhydride polymers for use as curing agents in epoxy resin-based underfill material App 20030118835 - Jayaraman, Saikumar ; et al.	2003-06-26
Thermal interface material and electronic assembly having such a thermal interface material App 20030077478 - Dani, Ashay A. ; et al.	2003-04-24
Catalyst and methods for polymerizing cycloolefins App 20030023013 - Lipian, John-Henry ; et al.	2003-01-30
Modified polycyclic polymers App 20030018153 - Jayaraman, Saikumar ; et al.	2003-01-23
Photoresist compositions comprising polycyclic polymers with acid labile pendant groups App 20020136982 - Goodall, Brian L. ; et al.	2002-09-26
Catalyst and methods for polymerizing cycloolefins Grant 6,455,650 - Lipian , et al. September 24, 2	2002-09-24
Modified polycyclic polymers Grant 6,451,945 - Jayaraman , et al. September 17, 2	2002-09-17
Photoresist compositions comprising polycyclic polymers with acid labile pendant groups App 20020128408 - Goodall, Brian L. ; et al.	2002-09-12
Norbornene sulfonamide polymers Grant 6,420,503 - Jayaraman , et al. July 16, 2	2002-07-16
Catalyst And Methods For Polymerizing Cycloolefins App 20020052454 - LIPIAN, JOHN-HENRY ; et al.	2002-05-02
Photoresist compositions comprising polycyclic polymers with acid labile pendant groups Grant 6,232,417 - Rhodes , et al. May 15, 2	2001-05-15
Polycyclic resist compositions with increased etch resistance Grant 6,147,177 - Jayaraman , et al. November 14, 2	2000-11-14
Photoresist compositions comprising polycyclic polymers with acid labile pendant groups Grant 6,136,499 - Goodall , et al. October 24, 2	2000-10-24
Photodefinable dielectric compositions comprising polycyclic polymers Grant 6,121,340 - Shick , et al. September 19, 2	2000-09-19
Addition polymers of polycycloolefins containing silyl functional groups Grant 6,031,058 - McIntosh, III , et al. February 29, 2	2000-02-29
Addition polymers of polycycloolefins containing silyl functional groups Grant 5,912,313 - McIntosh, III , et al. June 15, 1	1999-06-15