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Patent applications and USPTO patent grants for Jayaraju; Nagarajan.The latest application filed is for "method of filling through-holes to reduce voids and other defects".
Patent | Date |
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Method of filling through-holes to reduce voids and other defects Grant 10,512,174 - Jayaraju , et al. Dec | 2019-12-17 |
Method of filling through-holes to reduce voids and other defects Grant 10,508,357 - Jayaraju , et al. Dec | 2019-12-17 |
Filling through-holes Grant 10,154,598 - Jayaraju , et al. Dec | 2018-12-11 |
Method Of Filling Through-holes To Reduce Voids And Other Defects App 20170233886 - Jayaraju; Nagarajan ;   et al. | 2017-08-17 |
Method Of Filling Through-holes To Reduce Voids And Other Defects App 20170238427 - Jayaraju; Nagarajan ;   et al. | 2017-08-17 |
Method of filling through-holes Grant 9,598,787 - Jayaraju , et al. March 21, 2 | 2017-03-21 |
Filling Through-holes App 20160105975 - Jayaraju; Nagarajan ;   et al. | 2016-04-14 |
Method Of Filling Through-holes App 20140262799 - JAYARAJU; Nagarajan ;   et al. | 2014-09-18 |
Method Of Filling Through-holes App 20140262801 - JAYARAJU; Nagarajan ;   et al. | 2014-09-18 |
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