Japp, Robert Maynard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Japp, Robert Maynard.The latest application filed is for "uv absorbing glass cloth and use thereof".

Company Profile

0.15.4

Japp, Robert Maynard - Vestal NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
UV absorbing glass cloth and use thereof App 20050026051 - Japp, Robert Maynard ; et al.	2005-02-03
Method for reducing coefficient of thermal expansion in chip attach packages Grant 6,841,026 - Blumberg , et al. January 11, 2	2005-01-11
UV absorbing glass cloth and use thereof Grant 6,838,400 - Japp , et al. January 4, 2	2005-01-04
Method for reducing coefficient of thermal expansion in chip attach packages App 20030000081 - Blumberg, Lawrence Robert ; et al.	2003-01-02
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use App 20030003305 - Japp, Robert Maynard ; et al.	2003-01-02
Electronic package utilizing protective coating Grant 6,351,030 - Havens , et al. February 26, 2	2002-02-26
Electronic Package Utilizing Protective Coating App 20010011773 - HAVENS, ROSS DOWNEY ; et al.	2001-08-09
Printed circuit board with circuitized cavity and methods of producing same Grant 6,214,525 - Boyko , et al. April 10, 2	2001-04-10
Laminated electroplating rack and connection system for optimized plating Grant 6,176,985 - Downes, Jr. , et al. January 23, 2	2001-01-23
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing Grant 6,096,665 - Appelt , et al. August 1, 2	2000-08-01
Printed circuit board with cavity for circuitization Grant 6,066,386 - Boyko , et al. May 23, 2	2000-05-23
Dustfree prepreg and method for making an article based thereon Grant 5,928,970 - Appelt , et al. July 27, 1	1999-07-27
Technique for forming resin-impregnated fiberglass sheets using multiple resins Grant 5,919,525 - Appelt , et al. July 6, 1	1999-07-06
Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates Grant 5,900,675 - Appelt , et al. May 4, 1	1999-05-04
Method for providing a protective coating and electronic package utilizing same Grant 5,888,850 - Havens , et al. March 30, 1	1999-03-30
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing Grant 5,858,461 - Appelt , et al. January 12, 1	1999-01-12
Method for fabricating printed circuit boards with cavities Grant 5,784,782 - Boyko , et al. July 28, 1	1998-07-28
Technique for forming resin-impregnated fiberglass sheets Grant 5,773,371 - Appelt , et al. June 30, 1	1998-06-30
Technique for forming resin-impregnated fiberglass sheets Grant 5,756,405 - Appelt , et al. May 26, 1	1998-05-26

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