Japp; Robert M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Japp; Robert M..The latest application filed is for "method of forming fibrous laminate chip carrier structures".

Company Profile

0.35.30

Japp; Robert M. - Vestal NY US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making halogen-free circuitized substrate with reduced thermal expansion Grant 8,499,440 - Japp , et al. August 6, 2	2013-08-06
Multilayered circuitized substrate with P-aramid dielectric layers and method of making same Grant 8,211,790 - Japp , et al. July 3, 2	2012-07-03
Power core for use in circuitized substrate and method of making same Grant 8,198,551 - Japp , et al. June 12, 2	2012-06-12
Method Of Forming Fibrous Laminate Chip Carrier Structures App 20120012553 - Japp; Robert M. ; et al.	2012-01-19
Circuitized substrate with continuous thermoplastic support film dielectric layers Grant 8,084,863 - Japp , et al. December 27, 2	2011-12-27
Power Core For Use In Circuitized Substrate And Method Of Making Same App 20110284273 - Japp; Robert M. ; et al.	2011-11-24
Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates App 20110207866 - Japp; Robert M. ; et al.	2011-08-25
Dielectric composition for use in circuitized substrates and circuitized substrate including same Grant 7,931,830 - Japp , et al. April 26, 2	2011-04-26
Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same Grant 7,687,722 - Japp , et al. March 30, 2	2010-03-30
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same Grant 7,646,098 - Japp , et al. January 12, 2	2010-01-12
Circuitized substrate with P-aramid dielectric layers and method of making same App 20090258161 - Japp; Robert M. ; et al.	2009-10-15
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein Grant 7,596,863 - Bhatt , et al. October 6, 2	2009-10-06
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same App 20090173426 - Japp; Robert M. ; et al.	2009-07-09
Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same App 20090175000 - Japp; Robert M. ; et al.	2009-07-09
Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same Grant 7,470,990 - Japp , et al. December 30, 2	2008-12-30
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same Grant 7,429,789 - Japp , et al. September 30, 2	2008-09-30
Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion Grant 7,416,972 - Japp , et al. August 26, 2	2008-08-26
Circuitized substrate with p-aramid dielectric layers and method of making same App 20080191354 - Japp; Robert M. ; et al.	2008-08-14
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same App 20080191353 - Japp; Robert M. ; et al.	2008-08-14
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein App 20080168651 - Bhatt; Ashwinkumar C. ; et al.	2008-07-17
Method of making circuitized substrate Grant 7,381,587 - Japp , et al. June 3, 2	2008-06-03
Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing App 20080078570 - Japp; Robert M. ; et al.	2008-04-03
Drill stack formation Grant 7,329,446 - Japp , et al. February 12, 2	2008-02-12
Drill Stack Formation App 20080032155 - Japp; Robert M. ; et al.	2008-02-07
Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion App 20070182016 - Japp; Robert M. ; et al.	2007-08-09
Method of making circuitized substrate App 20070166944 - Japp; Robert M. ; et al.	2007-07-19
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same App 20060180936 - Japp; Robert M. ; et al.	2006-08-17
UV absorbing glass cloth and use thereof Grant 7,070,909 - Japp , et al. July 4, 2	2006-07-04
Dielectric composition for use in circuitized substrates and circuitized substrate including same App 20060054870 - Japp; Robert M. ; et al.	2006-03-16
Formation of multisegmented plated through holes Grant 6,996,903 - Farquhar , et al. February 14, 2	2006-02-14
Method and structure for small pitch z-axis electrical interconnections Grant 6,955,849 - Curcio , et al. October 18, 2	2005-10-18
Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20050218524 - Japp, Robert M. ; et al.	2005-10-06
Porous power and ground planes for reduced PCB delamination and better reliability Grant 6,944,946 - Japp , et al. September 20, 2	2005-09-20
Formation of multisegmented plated through holes App 20050079289 - Farquhar, Donald S. ; et al.	2005-04-14
Composite Laminate Circuit Structure App 20050048408 - Japp, Robert M. ; et al.	2005-03-03
Method and structure for small pitch z-axis electrical interconnections App 20050008833 - Curcio, Brian E. ; et al.	2005-01-13
Method of fabricating a laminate circuit structure Grant 6,834,426 - Japp , et al. December 28, 2	2004-12-28
Method of making a multi-layered interconnect structure Grant 6,829,823 - Downes, Jr. , et al. December 14, 2	2004-12-14
Laminate circuit structure and method of fabricating Grant 6,820,332 - Japp , et al. November 23, 2	2004-11-23
Method and structure for small pitch z-axis electrical interconnections Grant 6,790,305 - Curcio , et al. September 14, 2	2004-09-14
Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom Grant 6,734,259 - Japp , et al. May 11, 2	2004-05-11
Drill stack formation App 20040086741 - Japp, Robert M. ; et al.	2004-05-06
Resin Composition With A Polymerizing Agent And Method Of Manufacturing Prepreg And Other Laminate Structures Therefrom App 20040082730 - Japp, Robert M. ; et al.	2004-04-29
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane Grant 6,722,031 - Japp , et al. April 20, 2	2004-04-20
Method and structure for small pitch z-axis electrical interconnections App 20040067347 - Curcio, Brian E. ; et al.	2004-04-08
Formation of multisegmented plated through holes Grant 6,700,078 - Farquhar , et al. March 2, 2	2004-03-02
Drill stack formation Grant 6,669,805 - Japp , et al. December 30, 2	2003-12-30
Porous power and ground planes for reduced PCB delamination and better reliability App 20030196749 - Japp, Robert M. ; et al.	2003-10-23
Porous power and ground planes for reduced PCB delamination and better reliability Grant 6,613,413 - Japp , et al. September 2, 2	2003-09-02
Laminate circuit structure and method of fabricating App 20030042046 - Japp, Robert M. ; et al.	2003-03-06
Drill stack formation App 20030022013 - Japp, Robert M. ; et al.	2003-01-30
Formation of multisegmented plated through holes App 20020164468 - Farquhar, Donald S. ; et al.	2002-11-07
Chip C4 assembly improvement using magnetic force and adhesive Grant 6,429,384 - Downes, Jr. , et al. August 6, 2	2002-08-06
Formation of multisegmented plated through holes Grant 6,426,470 - Farquhar , et al. July 30, 2	2002-07-30
Formation Of Multisegmented Plated Through Holes App 20020092677 - Farquhar, Donald S. ; et al.	2002-07-18
Electronic package with high density interconnect layer App 20020085364 - Downes, Francis J. JR. ; et al.	2002-07-04
Multilayer capacitance structure and circuit board containing the same and method of forming the same App 20020080556 - Japp, Robert M. ; et al.	2002-06-27
Circuit package having low modulus, conformal mounting pads Grant 6,399,896 - Downes, Jr. , et al. June 4, 2	2002-06-04
Low CTE power and ground planes App 20020050402 - Japp, Robert M. ; et al.	2002-05-02
Electronic package with high density interconnect layer Grant 6,373,717 - Downes, Jr. , et al. April 16, 2	2002-04-16
Low CTE power and ground planes Grant 6,329,603 - Japp , et al. December 11, 2	2001-12-11
Chip C4 assembly improvement using magnetic force and adhesive Grant 6,142,361 - Downes, Jr. , et al. November 7, 2	2000-11-07
Fluid jet impregnation Grant 5,824,157 - Foster , et al. October 20, 1	1998-10-20
Flame retardant, low dielectric constant microsphere filled laminate Grant 5,126,192 - Chellis , et al. June 30, 1	1992-06-30

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