Jao; Sheng Huang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jao; Sheng Huang.The latest application filed is for "through-silicon via formed with a post passivation interconnect structure".
- Jao; Sheng Huang - Jiayi TW
- JAO; Sheng Huang - Jiayi City TW
| Patent | Date |
|---|---|
| Through-silicon via formed with a post passivation interconnect structure Grant 8,390,125 - Tseng , et al. March 5, 2 | 2013-03-05 |
| Through-silicon Via Formed With A Post Passivation Interconnect Structure App 20110169168 - TSENG; Ming-Hong ; et al. | 2011-07-14 |
| Through-silicon via formed with a post passivation interconnect structure Grant 7,932,608 - Tseng , et al. April 26, 2 | 2011-04-26 |
| Through-silicon Via Formed With A Post Passivation Interconnect Structure App 20100213612 - Tseng; Ming-Hong ; et al. | 2010-08-26 |
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