Jao; Hui Mei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jao; Hui Mei.The latest application filed is for "method of forming shallow trench isolation structure".
- Jao; Hui Mei - Tainan TW
- JAO; Hui Mei - Tainan City TW
| Patent | Date |
|---|---|
| Method of forming shallow trench isolation structure Grant 9,368,387 - Yu , et al. June 14, 2 | 2016-06-14 |
| Method Of Forming Shallow Trench Isolation Structure App 20160005669 - YU; Tai-Yung ; et al. | 2016-01-07 |
| Soft material wafer bonding and method of bonding Grant 8,748,885 - Yeh , et al. June 10, 2 | 2014-06-10 |
| Wafer and method of processing wafer Grant 8,592,297 - Yeh , et al. November 26, 2 | 2013-11-26 |
| Soft Material Wafer Bonding And Method Of Bonding App 20130207098 - YEH; Tung-Ti ; et al. | 2013-08-15 |
| Wafer And Method Of Processing Wafer App 20130154060 - YEH; Tung-Ti ; et al. | 2013-06-20 |
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