JANGJIAN; PENG-CHUNG

Patent Applications and Registrations

Patent applications and USPTO patent grants for JANGJIAN; PENG-CHUNG.The latest application filed is for "composition and method for polishing and integrated circuit".

Company Profile

5.7.9

JANGJIAN; PENG-CHUNG - HSINCHU TW
Jangjian; Peng-Chung - Zhudong Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition And Method For Polishing And Integrated Circuit App 20220017780 - CUI; JI ; et al.	2022-01-20
Slurry Composition And Method For Polishing And Integratged Circuit App 20210371702 - CUI; JI ; et al.	2021-12-02
FinFET contacts and method forming same Grant 11,189,727 - Jangjian , et al. November 30, 2	2021-11-30
Fin Isolation Structure For Finfet And Method Of Forming The Same App 20210265222 - LEE; Chu-An ; et al.	2021-08-26
Fin isolation structure for FinFET and method of forming the same Grant 10,998,239 - Lee , et al. May 4, 2	2021-05-04
Finfet Contacts And Method Forming Same App 20210057571 - Jangjian; Peng-Chung ; et al.	2021-02-25
Chemical Mechanical Planarization Tool App 20210053180 - Yen; Michael ; et al.	2021-02-25
Fin Isolation Structure For Finfet And Method Of Forming The Same App 20200365588 - LEE; Chu-An ; et al.	2020-11-19
Fin isolation structure for FinFET and method of forming the same Grant 10,714,395 - Lee , et al.	2020-07-14
Fin Isolation Structure For Finfet And Method Of Forming The Same App 20200091007 - LEE; Chu-An ; et al.	2020-03-19
Adaptive endpoint method for pad life effect on chemical mechanical polishing Grant 9,333,619 - Lee , et al. May 10, 2	2016-05-10
Adapative Endpoint Method For Pad Life Effect On Chemical Mechanical Polishing App 20130146224 - Lee; Chu-An ; et al.	2013-06-13
Adaptive endpoint method for pad life effect on chemical mechanical polishing Grant 8,367,429 - Lee , et al. February 5, 2	2013-02-05
Adaptive Endpoint Method For Pad Life Effect On Chemical Mechanical Polishing App 20120231555 - Lee; Chu-An ; et al.	2012-09-13

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