loadpatents
Patent applications and USPTO patent grants for JANG; Yong Soon.The latest application filed is for "connection structure embedded substrate".
Patent | Date |
---|---|
Connection Structure Embedded Substrate App 20220157730 - JANG; Yong Soon ;   et al. | 2022-05-19 |
Printed Circuit Board App 20220124906 - LEE; Jae Heun ;   et al. | 2022-04-21 |
Printed circuit board Grant 11,297,714 - Ko , et al. April 5, 2 | 2022-04-05 |
Package substrate Grant 11,088,089 - Oh , et al. August 10, 2 | 2021-08-10 |
Package Substrate App 20210066210 - OH; Yoong ;   et al. | 2021-03-04 |
Printed Circuit Board App 20210029825 - KO; Young-Kuk ;   et al. | 2021-01-28 |
Printed circuit board Grant 10,849,225 - Ko , et al. November 24, 2 | 2020-11-24 |
Package substrate Grant 9,357,646 - Lee , et al. May 31, 2 | 2016-05-31 |
Package Substrate App 20150216048 - LEE; Sang Min ;   et al. | 2015-07-30 |
Electronic Component Embedded Printing Circuit Board And Method For Manufacturing The Same App 20140153204 - Kim; Moon Il ;   et al. | 2014-06-05 |
Hole plugging method for printed circuit boards, and hole plugging device Grant 7,337,535 - Lee , et al. March 4, 2 | 2008-03-04 |
Method for plugging holes in a printed circuit board Grant 6,954,985 - Lee , et al. October 18, 2 | 2005-10-18 |
Method for manufacturing a printed circuit board Grant 6,851,184 - Lee , et al. February 8, 2 | 2005-02-08 |
Hole plugging method for printed circuit boards, and hole plugging device App 20040154166 - Lee, Sung Gue ;   et al. | 2004-08-12 |
Plating method for PCB App 20040050708 - Yang, Yu-Seock ;   et al. | 2004-03-18 |
Method for forming exposed portion of circuit pattern in printed circuit board Grant 6,641,983 - Lee , et al. November 4, 2 | 2003-11-04 |
Method for manufacturing a printed circuit board App 20030014863 - Lee, Sung Gue ;   et al. | 2003-01-23 |
Hole plugging method for printed circuit boards, and hole plugging device App 20020184757 - Lee, Sung Gue ;   et al. | 2002-12-12 |
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