Jang; Yeonho
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jang; Yeonho.The latest application filed is for "semiconductor package device".
- Jang; Yeonho - Goyang-si KR
- JANG; YEONHO - Cheonan-si KR
- Jang; Yeonho - Hwasung-si KR
| Patent | Date |
|---|---|
| Semiconductor package Grant 11,456,241 - Lee , et al. September 27, 2 | 2022-09-27 |
| Semiconductor Package Device App 20220084993 - KIM; DONGKYU ; et al. | 2022-03-17 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210407940 - Kim; Jongyoun ; et al. | 2021-12-30 |
| Semiconductor package and method of manufacturing the same Grant 11,145,611 - Kim , et al. October 12, 2 | 2021-10-12 |
| Semiconductor package and method of manufacturing the semiconductor package Grant 11,094,636 - Jang , et al. August 17, 2 | 2021-08-17 |
| Method of manufacturing fan-out wafer level package Grant 11,056,461 - Jang , et al. July 6, 2 | 2021-07-06 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210125908 - JANG; Yeonho ; et al. | 2021-04-29 |
| Semiconductor Package App 20210111114 - LEE; Seokhyun ; et al. | 2021-04-15 |
| Semiconductor Package App 20210028137 - JEON; GWANGJAE ; et al. | 2021-01-28 |
| Method Of Manufacturing Fan-out Wafer Level Package App 20210020600 - JANG; Yeonho ; et al. | 2021-01-21 |
| Semiconductor Package And Method Of Manufacturing The Same App 20200411458 - Kim; Jongyoun ; et al. | 2020-12-31 |
| Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20200373243 - JANG; Jaegwon ; et al. | 2020-11-26 |
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