Jang; Tae Hoan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jang; Tae Hoan.The latest application filed is for "semiconductor device and method of forming enhanced ubm structure for improving solder joint reliability".

Company Profile

0.6.5

Jang; Tae Hoan - Singapore SG
Jang; Tae Hoan - Seoul KR
Jang, Tae Hoan - Seoul City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability Grant 7,989,356 - Bao , et al. August 2, 2	2011-08-02
Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof Grant 7,863,726 - Chow , et al. January 4, 2	2011-01-04
Semiconductor Device and Method of Forming Enhanced UBM Structure for Improving Solder Joint Reliability App 20100244239 - Bao; Xusheng ; et al.	2010-09-30
Integrated Circuit Package System With Package Substrate Having Corner Contacts And Method Of Manufacture Thereof App 20100052150 - Chow; Seng Guan ; et al.	2010-03-04
Integrated circuit package system with package substrate having corner contacts Grant 7,646,105 - Chow , et al. January 12, 2	2010-01-12
Integrated Circuit Package System With Package Substrate Having Corner Contacts App 20090127719 - Chow; Seng Guan ; et al.	2009-05-21
Semiconductor package and method for fabricating the same Grant 7,190,071 - Shin , et al. March 13, 2	2007-03-13
Semiconductor package and method for fabricating the same App 20040164411 - Shin, Won Sun ; et al.	2004-08-26
Semiconductor package and method for fabricating the same Grant 6,717,248 - Shin , et al. April 6, 2	2004-04-06
Semiconductor package and method for fabricating the same App 20030100142 - Shin, Won Sun ; et al.	2003-05-29
Semiconductor package and method for fabricating the same Grant 6,515,356 - Shin , et al. February 4, 2	2003-02-04

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