Jang; Kyung Woon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jang; Kyung Woon.The latest application filed is for "display comprising light-emitting chips and manufacturing method therefor".

Company Profile

3.7.9

Jang; Kyung Woon - Suwon-si KR
Jang; Kyung Woon - Seoul KR
JANG; Kyung-Woon - Daejeon KR
Jang; Kyung Woon - Jeonrabuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Display apparatus and manufacturing method for the same Grant 11,437,410 - Lee , et al. September 6, 2	2022-09-06
Display comprising light-emitting chips and manufacturing method therefor Grant 11,387,220 - Jang , et al. July 12, 2	2022-07-12
Display comprising light-emitting chips and manufacturing method therefor Grant 11,355,479 - Jang , et al. June 7, 2	2022-06-07
Display Comprising Light-emitting Chips And Manufacturing Method Therefor App 20200235078 - JANG; Kyung Woon ; et al.	2020-07-23
Display Apparatus And Manufacturing Method For The Same App 20200105792 - LEE; Chang Joon ; et al.	2020-04-02
Fingerprint recognition device, method of manufacturing the same, and electronic device thereof Grant 10,229,306 - Kim , et al.	2019-03-12
Lamination apparatus and lamination method using the same Grant 10,105,943 - Kim , et al. October 23, 2	2018-10-23
Fingerprint Recognition Device, Method Of Manufacturing The Same, And Electronic Device Thereof App 20160350572 - KIM; Il ; et al.	2016-12-01
Lamination Apparatus And Lamination Method Using The Same App 20160318293 - KIM; Do Hyung ; et al.	2016-11-03
Functional Sheet App 20130202848 - KIM; Mi Jin ; et al.	2013-08-08
Method of fabricating printed circuit board assembly Grant 8,327,534 - Park , et al. December 11, 2	2012-12-11
Printed Circuit Board Assembly Manufacturing Device And Method App 20120018084 - Jang; Kyung Woon ; et al.	2012-01-26
Method of fabricating printed circuit board assembly App 20110154661 - Park; Min Young ; et al.	2011-06-30
Wafer-level Aca Flip Chip Package Using Double-layered Aca/nca App 20090029504 - PAIK; Kyung-Wook ; et al.	2009-01-29
Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same Grant 7,381,468 - Paik , et al. June 3, 2	2008-06-03
Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same App 20050080175 - Paik, Kyung Wook ; et al.	2005-04-14

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