Jang; Kyung-Lae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jang; Kyung-Lae.The latest application filed is for "package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same".

Company Profile

0.7.9

Jang; Kyung-Lae - Seongnam-si JP
Jang; Kyung-Lae - Yongin-si KR
Jang; Kyung-Lae - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same App 20100117451 - Jang; Kyung-Lae ; et al.	2010-05-13
Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same Grant 7,663,221 - Jang , et al. February 16, 2	2010-02-16
Semiconductor package on package having plug-socket type wire connection between packages Grant 7,652,367 - Jang , et al. January 26, 2	2010-01-26
Bonding configurations for lead-frame-based and substrate-based semiconductor packages Grant 7,566,954 - Jang , et al. July 28, 2	2009-07-28
Semiconductor Package On Package Having Plug-socket Type Wire Connection Between Packages App 20080150116 - JANG; Kyung-Lae ; et al.	2008-06-26
Semiconductor package with conductive molding compound and manufacturing method thereof Grant 7,374,969 - Cho , et al. May 20, 2	2008-05-20
Semiconductor chip package Grant 7,372,139 - Lee , et al. May 13, 2	2008-05-13
Printed circuit board having a bond wire shield structure for a signal transmission line Grant 7,330,084 - Lee , et al. February 12, 2	2008-02-12
Semiconductor device package Grant 7,327,038 - Kwon , et al. February 5, 2	2008-02-05
Semiconductor device package App 20060138624 - Kwon; Heung-Kyu ; et al.	2006-06-29
Printed circuit board having shield structure of signal transmission line App 20060119448 - Lee; Hee-Seok ; et al.	2006-06-08
Semiconductor package with conductive molding compound and manufacturing method thereof App 20060097404 - Cho; Byeong-Yeon ; et al.	2006-05-11
Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof App 20060017142 - Jang; Kyung Lae ; et al.	2006-01-26
Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same App 20050242426 - Kwon, Heung-Kyu ; et al.	2005-11-03
Semiconductor chip package App 20050230852 - Lee, Hee-seok ; et al.	2005-10-20
Package circuit board and package including a package circuit board and method thereof App 20050146018 - Jang, Kyung-Lae ; et al.	2005-07-07

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