| Patent | Date |
|---|
Electronic Device Including Battery
App 20220302545 - JANG; Kiyoun ; et al. | 2022-09-22 |
Battery And Electronic Device Including Battery
App 20220140403 - KIM; Sunjin ; et al. | 2022-05-05 |
Battery And Electronic Device Comprising Same
App 20210234203 - JANG; Kiyoun ; et al. | 2021-07-29 |
Method To Charge Battery And Electronic Device Including Battery
App 20210091586 - JANG; Kiyoun ; et al. | 2021-03-25 |
Battery And Electronic Device Including Same
App 20210020893 - Jeon; Yongsub ; et al. | 2021-01-21 |
Electronic Device Including Cooling Function And Controlling Method Thereof
App 20200389996 - JEONG; Chihwan ; et al. | 2020-12-10 |
Electronic device including cooling function and controlling method thereof
Grant 10,785,887 - Jeong , et al. Sept | 2020-09-22 |
Electronic device having wireless power transmitting/receiving conductive pattern
Grant 10,680,470 - Jang , et al. | 2020-06-09 |
Electronic Device Having Wireless Power Transmitting/receiving Conductive Pattern
App 20190123599 - JANG; Kiyoun ; et al. | 2019-04-25 |
Electronic device having wireless power transmitting/receiving conductive pattern
Grant 10,158,261 - Jang , et al. Dec | 2018-12-18 |
Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
Grant 10,096,540 - Lee , et al. October 9, 2 | 2018-10-09 |
Electronic Device Including Cooling Function And Controlling Method Thereof
App 20180288898 - Jeong; Chihwan ; et al. | 2018-10-04 |
Electronic Device Having Wireless Power Transmitting/receiving Conductive Pattern
App 20170047791 - Jang; Kiyoun ; et al. | 2017-02-16 |
Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection
Grant 9,460,972 - Park , et al. October 4, 2 | 2016-10-04 |
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
Grant 9,236,332 - Pagaila , et al. January 12, 2 | 2016-01-12 |
Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure
Grant 9,230,933 - Lee , et al. January 5, 2 | 2016-01-05 |
Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
Grant 9,117,812 - Lee , et al. August 25, 2 | 2015-08-25 |
Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate
Grant 9,054,100 - Lee , et al. June 9, 2 | 2015-06-09 |
Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material
Grant 9,030,030 - Lee , et al. May 12, 2 | 2015-05-12 |
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
Grant 8,896,133 - Cho , et al. November 25, 2 | 2014-11-25 |
Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process
Grant 8,884,339 - Jang , et al. November 11, 2 | 2014-11-11 |
Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
App 20140159236 - Kim; BaeYong ; et al. | 2014-06-12 |
Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers
Grant 8,742,566 - Jang , et al. June 3, 2 | 2014-06-03 |
Semiconductor Device and Method of Forming Non-Linear Interconnect Layer with Extended Length for Joint Reliability
App 20140103503 - Lee; JaeHyun ; et al. | 2014-04-17 |
Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
Grant 8,642,384 - Lee , et al. February 4, 2 | 2014-02-04 |
Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
Grant 8,563,418 - Pagaila , et al. October 22, 2 | 2013-10-22 |
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
App 20130264705 - Jang; KiYoun ; et al. | 2013-10-10 |
Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate
App 20130234324 - Cho; SungWon ; et al. | 2013-09-12 |
Semiconductor Device and Method of Forming Non-Linear Interconnect Layer with Extended Length for Joint Reliability
App 20130234318 - Lee; JaeHyun ; et al. | 2013-09-12 |
Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process
Grant 8,519,536 - Jang , et al. August 27, 2 | 2013-08-27 |
Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
Grant 8,492,197 - Cho , et al. July 23, 2 | 2013-07-23 |
Semiconductor Device and Method of Forming Reduced Surface Roughness in Molded Underfill for Improved C-SAM Inspection
App 20130175701 - Park; SeongWon ; et al. | 2013-07-11 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe
App 20130154067 - Pagaila; Reza A. ; et al. | 2013-06-20 |
Semiconductor Device and Method of Forming Adjacent Channel and Dam Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material
App 20130147065 - Lee; KyungHoon ; et al. | 2013-06-13 |
Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers
App 20130134586 - Jang; KiYoun ; et al. | 2013-05-30 |
Semiconductor Die and Method of Forming Sloped Surface in Photoresist Layer to Enhance Flow of Underfill Material Between Semiconductor Die and Substrate
App 20130105967 - Lee; JaeHyun ; et al. | 2013-05-02 |
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
App 20130087913 - Jang; KiYoun ; et al. | 2013-04-11 |
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
Grant 8,409,978 - Pagaila , et al. April 2, 2 | 2013-04-02 |
Semiconductor Device and Method of Forming Conductive Protrusions Over Conductive Pillars or Bond Pads as Fixed Offset Vertical Interconnect Structures
App 20130069221 - Lee; JaeHyun ; et al. | 2013-03-21 |
Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material
Grant 8,399,300 - Lee , et al. March 19, 2 | 2013-03-19 |
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
Grant 8,389,398 - Jang , et al. March 5, 2 | 2013-03-05 |
Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process
Grant 8,367,467 - Jang , et al. February 5, 2 | 2013-02-05 |
Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance
App 20120286418 - Lee; KyungHoon ; et al. | 2012-11-15 |
Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers
App 20120181690 - Jang; KiYoun ; et al. | 2012-07-19 |
Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers
Grant 8,169,071 - Jang , et al. May 1, 2 | 2012-05-01 |
Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate
App 20120043672 - Cho; SungWon ; et al. | 2012-02-23 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Different Height Traces
App 20120025373 - Pagaila; Reza A. ; et al. | 2012-02-02 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe
App 20110316132 - Pagaila; Reza A. ; et al. | 2011-12-29 |
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
App 20110260316 - Jang; KiYoun ; et al. | 2011-10-27 |
Semiconductor Device and Method of Forming Adjacent Channel and DAM Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material
App 20110260338 - Lee; KyungHoon ; et al. | 2011-10-27 |
Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
Grant 8,039,384 - Pagaila , et al. October 18, 2 | 2011-10-18 |
Semiconductor Device And Method Of Forming Vertically Offset Bond On Trace Interconnects On Different Height Traces
App 20110221058 - Pagaila; Reza A. ; et al. | 2011-09-15 |
Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers
App 20110121452 - Jang; KiYoun ; et al. | 2011-05-26 |
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers
Grant 7,897,502 - Jang , et al. March 1, 2 | 2011-03-01 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers
App 20100059866 - Jang; KiYoun ; et al. | 2010-03-11 |
Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
App 20090233436 - Kim; BaeYong ; et al. | 2009-09-17 |
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