Jang; Ki-Youn

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jang; Ki-Youn.The latest application filed is for "electronic device and heat control method based on temperature of battery in electronic device".

Company Profile

4.45.38

Jang; Ki-Youn - Suwon-si KR
Jang; Ki-Youn - Gyeonggi-do KR
Jang; Ki Youn - Ichon-si N/A KR
Jang; Ki Youn - Incheon KR
Jang; Ki Youn - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mobile communication terminal having radiant-heat sheet Grant RE48,641 - Jang , et al. July 13, 2	2021-07-13
Shield can assembly and electronic device including the same Grant 10,842,057 - Jang , et al. November 17, 2	2020-11-17
Electronic device and heat control method based on temperature of battery in electronic device Grant 10,698,461 - Jang , et al.	2020-06-30
Electronic device including shield structure Grant 10,470,345 - Ye , et al. No	2019-11-05
Electronic device and method for controlling fan of electronic device Grant 10,340,737 - Jung , et al.	2019-07-02
Heating control method and electronic device thereof Grant 10,197,457 - Jang , et al. Fe	2019-02-05
Shield can assembly and electronic device including the same Grant 10,064,318 - Jang , et al. August 28, 2	2018-08-28
Electronic Device And Heat Control Method Based On Temperature Of Battery In Electronic Device App 20180181171 - Jang; Ki Youn ; et al.	2018-06-28
Electronic Device Including Shield Structure App 20170172020 - YE; Jae-Heung ; et al.	2017-06-15
Mobile communication terminal having radiant-heat sheet Grant 9,582,051 - Jang , et al. February 28, 2	2017-02-28
Electronic Device And Method For Controlling Fan Of Electronic Device App 20170047784 - JUNG; Ku-Chul ; et al.	2017-02-16
Integrated circuit packaging system with connection structure and method of manufacture thereof Grant 9,202,715 - Kim , et al. December 1, 2	2015-12-01
Shield Can Assembly And Electronic Device Including The Same App 20150264844 - Jang; Ki-Youn ; et al.	2015-09-17
Epoxy bump for overhang die Grant 9,129,826 - Lee , et al. September 8, 2	2015-09-08
Mobile Communication Terminal Having Radiant-heat Sheet App 20150241935 - Jang; Ki-Youn ; et al.	2015-08-27
Shield Can Assembly And Electronic Device Including The Same App 20140362543 - Jang; Ki-Youn ; et al.	2014-12-11
Heating Control Method And Electronic Device Thereof App 20140362889 - JANG; Ki-Youn ; et al.	2014-12-11
Integrated circuit package system employing mold flash prevention technology Grant 8,772,916 - Jang , et al. July 8, 2	2014-07-08
Electronic system with expansion feature Grant 8,703,541 - Choi , et al. April 22, 2	2014-04-22
Integrated circuit packaging system with film assistance mold and method of manufacture thereof Grant 8,524,538 - Lee , et al. September 3, 2	2013-09-03
Semiconductor system with fine pitch lead fingers and method of manufacturing thereof Grant 8,519,517 - Lee , et al. August 27, 2	2013-08-27
Integrated circuit packaging system with routable underlayer and method of manufacture thereof Grant 8,513,057 - Kim , et al. August 20, 2	2013-08-20
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,471,394 - Jang , et al. June 25, 2	2013-06-25
Integrated Circuit Packaging System With Film Assistance Mold And Method Of Manufacture Thereof App 20130154121 - Lee; JaeHyun ; et al.	2013-06-20
Integrated Circuit Packaging System With Routable Underlayer And Method Of Manufacture Thereof App 20130069224 - Kim; Oh Han ; et al.	2013-03-21
Shielded stacked integrated circuit packaging system and method of manufacture thereof Grant 8,368,200 - Jang , et al. February 5, 2	2013-02-05
Integrated circuit packaging system with stacked lead and method of manufacture thereof Grant 8,304,900 - Jang , et al. November 6, 2	2012-11-06
Integrated Circuit Package System Employing Mold Flash Prevention Technology App 20120267801 - Jang; Ki Youn ; et al.	2012-10-25
Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof Grant 8,256,660 - Lee , et al. September 4, 2	2012-09-04
Integrated circuit package system employing mold flash prevention technology Grant 8,252,615 - Jang , et al. August 28, 2	2012-08-28
Electronic System With Expansion Feature App 20120193132 - Choi; Haengcheol ; et al.	2012-08-02
Integrated Circuit Packaging System With Connection Structure And Method Of Manufacture Thereof App 20120119360 - Kim; YoungChul ; et al.	2012-05-17
Electronic system with expansion feature Grant 8,178,392 - Choi , et al. May 15, 2	2012-05-15
Wire bond interconnection and method of manufacture thereof Grant 8,129,263 - Lee , et al. March 6, 2	2012-03-06
Integrated Circuit Packaging System With Stacked Lead And Method Of Manufacture Thereof App 20120038040 - Jang; Ki Youn ; et al.	2012-02-16
Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof Grant 8,110,908 - Kim , et al. February 7, 2	2012-02-07
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20120025398 - Jang; Ki Youn ; et al.	2012-02-02
Shielded Stacked Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20110298107 - Jang; Ki Youn ; et al.	2011-12-08
Semiconductor System With Fine Pitch Lead Fingers And Method Of Manufacturing Thereof App 20110285000 - Lee; Hun Teak ; et al.	2011-11-24
Wire Bond Interconnection And Method Of Manufacture Thereof App 20110266700 - Lee; Hun-Teak ; et al.	2011-11-03
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,035,235 - Jang , et al. October 11, 2	2011-10-11
Shielded stacked integrated circuit packaging system and method of manufacture thereof Grant 8,018,040 - Jang , et al. September 13, 2	2011-09-13
Wire bond interconnection Grant 7,986,047 - Lee , et al. July 26, 2	2011-07-26
Semiconductor Package System With Fine Pitch Lead Fingers And Method Of Manufacturing Thereof App 20110169149 - Lee; Hun Teak ; et al.	2011-07-14
Method of manufacturing a semiconductor package with fine pitch lead fingers Grant 7,909,233 - Lee , et al. March 22, 2	2011-03-22
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20110062574 - Jang; Ki Youn ; et al.	2011-03-17
Wire Bond Interconnection App 20100225008 - Lee; Hun-Teak ; et al.	2010-09-09
Semiconductor System With Fine Pitch Lead Fingers And Method Of Manufacture Thereof App 20100203683 - Lee; Hun Teak ; et al.	2010-08-12
Stacked integrated circuit package-in-package system Grant 7,772,683 - Jang , et al. August 10, 2	2010-08-10
Wire bond interconnection Grant 7,745,322 - Lee , et al. June 29, 2	2010-06-29
Integrated circuit underfill package system Grant 7,741,726 - Jeon , et al. June 22, 2	2010-06-22
Integrated Circuit Packaging System Using Bottom Flip Chip Die Bonding And Method Of Manufacture Thereof App 20100140769 - Kim; YoungJoon ; et al.	2010-06-10
Semiconductor system with fine pitch lead fingers Grant 7,731,078 - Lee , et al. June 8, 2	2010-06-08
Integrated circuit packaging system with passive components Grant 7,679,177 - Jang March 16, 2	2010-03-16
Shielded Stacked Integrated Circuit Packaging System And Method Of Manufacture Thereof App 20090194853 - Jang; Ki Youn ; et al.	2009-08-06
Method of fabricating a shielded stacked integrated circuit package system Grant 7,537,962 - Jang , et al. May 26, 2	2009-05-26
Integrated Circuit Underfill Package System App 20090096112 - Jeon; Hyung Jun ; et al.	2009-04-16
Integrated Circuit Packaging System With Passive Components App 20090079066 - Jang; Ki Youn	2009-03-26
Integrated circuit underfill package system Grant 7,485,502 - Jeon , et al. February 3, 2	2009-02-03
Electronic System With Expansion Feature App 20080283998 - Choi; Haengcheol ; et al.	2008-11-20
Wire bond interconnection Grant 7,453,156 - Lee , et al. November 18, 2	2008-11-18
Wire bond capillary tip Grant 7,407,080 - Lee , et al. August 5, 2	2008-08-05
Shielded Stacked Integrated Circuit Package System App 20080150093 - Jang; Ki Youn ; et al.	2008-06-26
Integrated Circuit Package System Employing Mold Flash Prevention Technology App 20080150119 - Jang; Ki Youn ; et al.	2008-06-26
Wire Bond Interconnection App 20080135997 - Lee; Hun-Teak ; et al.	2008-06-12
Stacked Integrated Circuit Package-in-package System App 20080136006 - Jang; Ki Youn ; et al.	2008-06-12
Integrated Circuit Underfill Package System App 20070176285 - Jeon; Hyung Jun ; et al.	2007-08-02
Bump For Overhang Device App 20070001296 - Lee; Hun Teak ; et al.	2007-01-04
Epoxy Bump for Overhang Die App 20060267609 - Lee; Hun-Teak ; et al.	2006-11-30
Wire bond interconnection App 20060113665 - Lee; Hun-Teak ; et al.	2006-06-01
Semiconductor system with fine pitch lead fingers App 20060102694 - Lee; Hun Teak ; et al.	2006-05-18
Wire bond capillary Tip App 20050218188 - Lee, Kenny ; et al.	2005-10-06

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