JANG; Keun Sam
Patent Applications and Registrations
Patent applications and USPTO patent grants for JANG; Keun Sam.The latest application filed is for "cmp slurry composition for copper films and method of polishing copper films using the same".
- JANG; Keun Sam - Suwon-si KR
- Jang; Keun-Sam - Ann Arbor MI
| Patent | Date |
|---|---|
| Cmp Slurry Composition For Copper Films And Method Of Polishing Copper Films Using The Same App 20210115296 - KIM; Hyeong Mook ; et al. | 2021-04-22 |
| Imaging agents Grant 10,259,781 - Raffel , et al. | 2019-04-16 |
| Imaging Agents App 20180230088 - Raffel; David M. ; et al. | 2018-08-16 |
| Imaging Agents App 20170190658 - Raffel; David M. ; et al. | 2017-07-06 |
| Imaging Agents App 20150246142 - Raffel; David M. ; et al. | 2015-09-03 |
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