JANG; Jun Hyeong
Patent Applications and Registrations
Patent applications and USPTO patent grants for JANG; Jun Hyeong.The latest application filed is for "electronic component-embedded substrate".
- JANG; Jun Hyeong - Suwon-si KR
| Patent | Date |
|---|---|
| Electronic Component-embedded Substrate App 20220301975 - HAM; Ho Hyung ; et al. | 2022-09-22 |
| Printed Circuit Board App 20220104345 - YOO; Ga Young ; et al. | 2022-03-31 |
| Printed Circuit Board, Electronic Component-embedded Substrate, And Manufacturing Method Thereof App 20220039261 - HWANG; Mi Sun ; et al. | 2022-02-03 |
| Substrate having electronic component embedded therein Grant 11,183,462 - Hwang , et al. November 23, 2 | 2021-11-23 |
| Electronic component embedded substrate Grant 11,076,487 - Hwang , et al. July 27, 2 | 2021-07-27 |
| Electronic Component Embedded Substrate App 20210193609 - Hwang; Mi Sun ; et al. | 2021-06-24 |
| Substrate Having Electronic Component Embedded Therein App 20210183784 - HWANG; Mi Sun ; et al. | 2021-06-17 |
| Electronic Component Embedded Substrate App 20210185819 - HWANG; Mi Sun ; et al. | 2021-06-17 |
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