JANG; Hyang-sun
Patent Applications and Registrations
Patent applications and USPTO patent grants for JANG; Hyang-sun.The latest application filed is for "bump electrode including plating layers and method of fabricating the same".
- JANG; Hyang-sun - Suwon-si KR
| Patent | Date |
|---|---|
| Bump Electrode Including Plating Layers And Method Of Fabricating The Same App 20080083983 - JANG; Hyang-sun ; et al. | 2008-04-10 |
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