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Patent applications and USPTO patent grants for Jang; Ho-Soo.The latest application filed is for "molding apparatus for semiconductor package".
Patent | Date |
---|---|
Semiconductor device fabrication process Grant 8,316,531 - Jang , et al. November 27, 2 | 2012-11-27 |
Molding Apparatus For Semiconductor Package App 20120225150 - HAN; Dong-Chul ;   et al. | 2012-09-06 |
Equipment and method for cutting package Grant 8,132,305 - Choi , et al. March 13, 2 | 2012-03-13 |
Apparatus And Method For Molding Compound App 20110171338 - Han; DongChul ;   et al. | 2011-07-14 |
Clamping Apparatus Including Movable Gripper And A Semiconductor Device Fabrication Process Using The Same App 20100119350 - JANG; Ho-Soo ;   et al. | 2010-05-13 |
Equipment And Method For Cutting Package App 20080056832 - CHOI; Tai-Kew ;   et al. | 2008-03-06 |
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