Patent | Date |
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Semiconductor Device Having A Super Junction Structure And Method Of Manufacturing The Same App 20220005924 - LEE; Jae-gil ;   et al. | 2022-01-06 |
Semiconductor device having a super junction structure and method of manufacturing the same Grant 11,133,379 - Lee , et al. September 28, 2 | 2021-09-28 |
Semiconductor Device Having A Super Junction Structure And Method Of Manufacturing The Same App 20200127088 - LEE; Jae-gil ;   et al. | 2020-04-23 |
Semiconductor Device Having A Super Junction Structure And Method Of Manufacturing The Same App 20170179225 - LEE; Jae-gil ;   et al. | 2017-06-22 |
Power semiconductor device and methods for fabricating the same Grant 9,070,713 - Kim , et al. June 30, 2 | 2015-06-30 |
Power Semiconductor Device And Methods For Fabricating The Same App 20140141584 - KIM; Jin-myung ;   et al. | 2014-05-22 |
Method of fabricating high-voltage semiconductor device Grant 8,716,085 - Lee , et al. May 6, 2 | 2014-05-06 |
Power semiconductor device and methods for fabricating the same Grant 8,674,402 - Kim , et al. March 18, 2 | 2014-03-18 |
Semiconductor Device Having A Super Junction Structure And Method Of Manufacturing The Same App 20120299094 - LEE; Jae-gil ;   et al. | 2012-11-29 |
Power Semiconductor Device And Methods For Fabricating The Same App 20120261715 - KIM; Jin-myung ;   et al. | 2012-10-18 |
Superjunction Semiconductor Device App 20120161274 - Lee; Jae-gil ;   et al. | 2012-06-28 |
Superjunction semiconductor device Grant 8,084,815 - Lee , et al. December 27, 2 | 2011-12-27 |
Method of Fabricating High-Voltage Semiconductor Device App 20110097864 - Lee; Jae-gil ;   et al. | 2011-04-28 |
High-voltage semiconductor device and method of fabricating the same Grant 7,868,384 - Lee , et al. January 11, 2 | 2011-01-11 |
Superjunction semiconductor device Grant 7,655,981 - Lee , et al. February 2, 2 | 2010-02-02 |
Superjunction Semiconductor Device App 20080211053 - Lee; Jae-gil ;   et al. | 2008-09-04 |
High-Voltage Semiconductor Device and Method of Fabricating the Same App 20080111207 - Lee; Jae-gil ;   et al. | 2008-05-15 |
Surface acoustic wave (SAW) device package and method for packaging a SAW device Grant 7,362,038 - Jang , et al. April 22, 2 | 2008-04-22 |
Image sensor package and its manufacturing method Grant 7,359,579 - Paek , et al. April 15, 2 | 2008-04-15 |
Wafer level chip scale package Grant 7,335,986 - Paek , et al. February 26, 2 | 2008-02-26 |
Superjunction semiconductor device Grant 7,301,203 - Lee , et al. November 27, 2 | 2007-11-27 |
Power semiconductor device having high breakdown voltage, low on-resistance and small switching loss and method of forming the same Grant 7,276,405 - Choi , et al. October 2, 2 | 2007-10-02 |
High-voltage Semiconductor Device App 20070029597 - Lee; Jae-gil ;   et al. | 2007-02-08 |
Superjunction semiconductor device App 20070001230 - Lee; Jae-gil ;   et al. | 2007-01-04 |
Power semiconductor device having high breakdown voltage, low on-resistance and small switching loss and method of forming the same App 20050263818 - Choi, Young-chul ;   et al. | 2005-12-01 |
Power semiconductor device having high breakdown voltage, low on-resistance, and small switching loss and method of forming the same Grant 6,930,356 - Choi , et al. August 16, 2 | 2005-08-16 |
Superjunction semiconductor device App 20050116313 - Lee, Jae-gil ;   et al. | 2005-06-02 |
Power semiconductor device having high breakdown voltage, low on-resistance, and small switching loss and method of forming the same App 20040041229 - Chol, Young-chul ;   et al. | 2004-03-04 |