Jang; Eul Chul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jang; Eul Chul.The latest application filed is for "electrical characteristics of package substrates and semiconductor packages including the same".
- Jang; Eul Chul - Icheon-si KR
- JANG; Eul Chul - Icheon-si Gyeonggi-do KR
- Jang; Eul Chul - Gyeonggi-do KR
- Jang; Eul-Chul - Hsin-Chu TW
| Patent | Date |
|---|---|
| Electrical characteristics of package substrates and semiconductor packages including the same Grant 9,609,742 - Jang , et al. March 28, 2 | 2017-03-28 |
| Electrical Characteristics Of Package Substrates And Semiconductor Packages Including The Same App 20140175680 - JANG; Eul Chul ; et al. | 2014-06-26 |
| Circuit board having conductive shield member and semiconductor package using the same Grant 8,084,839 - Choi , et al. December 27, 2 | 2011-12-27 |
| Circuit Board Having Conductive Shield Member And Semiconductor Package Using The Same App 20100321900 - CHOI; Bok Kyu ; et al. | 2010-12-23 |
| Circuit board having conductive shield member and semiconductor package using the same Grant 7,808,072 - Choi , et al. October 5, 2 | 2010-10-05 |
| Circuit Board Having Conductive Shield Member And Semiconductor Package Using The Same App 20090224376 - CHOI; Bok Kyu ; et al. | 2009-09-10 |
| Stacked chip package with exposed lead-frame bottom surface App 20060027901 - Tsai; Ming-Sung ; et al. | 2006-02-09 |
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