JANG; Dong Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for JANG; Dong Hyun.The latest application filed is for "vehicular airbag device".

Company Profile

3.8.9

JANG; Dong Hyun - Hwaseong-si KR
JANG; Dong Hyun - Yongin-si Gyeonggi-do
JANG; Dong Hyun - Ansan-si KR
Jang; Dong-Hyun - Suwon KR
Jang; Dong-hyun - Suwon-si N/A KR
Jang; Dong-Hyun - Suwon-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vehicular Airbag Device App 20220126776 - JANG; Dong Hyun ; et al.	2022-04-28
Block Copolymer Comprising Hydrophilic First Block, Hydrophobic Second Block, And Functional Group Capable Of Specifically Binding To Thiol App 20210346308 - KIM; Won Jong ; et al.	2021-11-11
Parallel Thermoelectric Module App 20210074902 - KIM; Seo Young ; et al.	2021-03-11
Wafer level package having a stress relief spacer and manufacturing method thereof Grant 8,426,252 - Chung , et al. April 23, 2	2013-04-23
Semiconductor chip, method of fabricating the same, and stack module and memory card including the same Grant 8,415,804 - Lee , et al. April 9, 2	2013-04-09
Wafer Level Package Having A Stress Relief Spacer And Manufacturing Method Thereof App 20120261821 - Chung; Hyun-Soo ; et al.	2012-10-18
Wafer level package having a stress relief spacer and manufacturing method thereof Grant 8,232,644 - Chung , et al. July 31, 2	2012-07-31
Wafer Level Package Having A Stress Relief Spacer And Manufacturing Method Thereof App 20120104608 - Chung; Hyun-Soo ; et al.	2012-05-03
Wafer level package having a stress relief spacer and manufacturing method thereof Grant 8,120,177 - Chung , et al. February 21, 2	2012-02-21
Wafer Level Package Having A Stress Relief Spacer And Manufacturing Method Thereof App 20110031621 - Chung; Hyun-Soo ; et al.	2011-02-10
Semiconductor Chip, Method Of Fabricating The Same, And Stack Module And Memory Card Including The Same App 20100327422 - LEE; Ho-jin ; et al.	2010-12-30
Wafer level package having a stress relief spacer and manufacturing method thereof Grant 7,838,992 - Chung , et al. November 23, 2	2010-11-23
Wafer Level Package Having A Stress Relief Spacer And Manufacturing Method Thereof App 20090261474 - Chung; Hyun-Soo ; et al.	2009-10-22
Wafer level package having a stress relief spacer and manufacturing method thereof Grant 7,572,673 - Chung , et al. August 11, 2	2009-08-11
Wafer level package having a stress relief spacer and manufacturing method thereof App 20070152349 - Chung; Hyun-Soo ; et al.	2007-07-05

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