JANG; Byoungwook

Patent Applications and Registrations

Patent applications and USPTO patent grants for JANG; Byoungwook.The latest application filed is for "interposer and semiconductor package including the same".

Company Profile

0.7.10

JANG; Byoungwook - Asan-si KR
Jang; Byoungwook - Hwaseong-si KR
Jang; ByoungWook - Kyonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interposer And Semiconductor Package Including The Same App 20220189835 - YIM; Choongbin ; et al.	2022-06-16
Semiconductor Package And Method Of Fabricating The Same App 20160111347 - Kim; Jongkook ; et al.	2016-04-21
Semiconductor package and method of fabricating the same Grant 9,252,095 - Kim , et al. February 2, 2	2016-02-02
Semiconductor package and method of fabricating the same Grant 9,252,031 - Im , et al. February 2, 2	2016-02-02
Semiconductor Package And Method Of Fabricating The Same App 20150084170 - IM; Hohyeuk ; et al.	2015-03-26
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Grant 8,785,251 - Park , et al. July 22, 2	2014-07-22
Semiconductor Package And Method Of Fabricating The Same App 20140008795 - KIM; Jongkook ; et al.	2014-01-09
Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die App 20140004659 - Park; SooMoon ; et al.	2014-01-02
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Grant 8,569,895 - Park , et al. October 29, 2	2013-10-29
Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die App 20120211904 - Park; SooMoon ; et al.	2012-08-23
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die Grant 8,193,036 - Park , et al. June 5, 2	2012-06-05
Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die App 20120061858 - Park; SooMoon ; et al.	2012-03-15

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