Jang, Bor Zeng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jang, Bor Zeng.The latest application filed is for "layer manufacturing method and apparatus using full-area curing".
- Jang, Bor Zeng - Auburn AL
| Patent | Date |
|---|---|
| Layer manufacturing method and apparatus using full-area curing App 20020149137 - Jang, Bor Zeng ; et al. | 2002-10-17 |
| Method for producing environmentally stable reactive alloy powders Grant 6,444,009 - Liu , et al. September 3, 2 | 2002-09-03 |
| Freeform fabrication method using extrusion of non-cross-linking reactive prepolymers App 20020113331 - Zhang, Tan ; et al. | 2002-08-22 |
| Droplet deposition method for rapid formation of 3-D objects from non-cross-linking reactive polymers App 20020111707 - Li, Zhimin ; et al. | 2002-08-15 |
| Layer manufacturing using electrostatic imaging and lamination Grant 6,376,148 - Liu , et al. April 23, 2 | 2002-04-23 |
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