Janczek; Thies
Patent Applications and Registrations
Patent applications and USPTO patent grants for Janczek; Thies.The latest application filed is for "data carrier".
- Janczek; Thies - Molfsee DE
- Janczek; Thies - Regensburg DE
- Janczek, Thies - Flintbek DE
| Patent | Date |
|---|---|
| Data carrier Grant 7,516,900 - Janczek April 14, 2 | 2009-04-14 |
| Data carrier App 20070125865 - Janczek; Thies | 2007-06-07 |
| Pressure sensor component Grant 6,313,514 - Winterer , et al. November 6, 2 | 2001-11-06 |
| Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component App 20010021543 - Neu, Achim ; et al. | 2001-09-13 |
| Method of producing a pressure sensor component App 20010002119 - Winterer, Jurgen ; et al. | 2001-05-31 |
| Chip card and method of manufacturing a chip card Grant 6,020,627 - Fries , et al. February 1, 2 | 2000-02-01 |
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