Jan; Shin-Dar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jan; Shin-Dar.The latest application filed is for "manufacturing method of image-sensing module".

Company Profile

2.11.16

Jan; Shin-Dar - Hong Kong HK
Jan; Shin-Dar - Hsinchu TW
Jan; Shin-Dar - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method of image-sensing module Grant 10,573,776 - Jan , et al. Feb	2020-02-25
Manufacturing Method Of Image-sensing Module App 20190067363 - Jan; Shin-Dar ; et al.	2019-02-28
Image sensor module having flat material between circuit board and image sensing chip Grant 9,161,449 - Jan October 13, 2	2015-10-13
Image capturing module for reducing assembly tilt angle Grant 9,154,675 - Jan October 6, 2	2015-10-06
Method of aligning and assembling an image capturing module Grant 9,128,223 - Jan September 8, 2	2015-09-08
Optical Image Capturing Module And Method Of Manufacturing The Same, And Optical Auxiliary Unit App 20150198780 - Jan; Shin-Dar	2015-07-16
Image Sensor Module App 20150116954 - JAN; SHIN-DAR	2015-04-30
Image Capturing Module And Method Of Aligning And Assembling The Same App 20150116580 - JAN; SHIN-DAR	2015-04-30
Image Capturing Module For Reducing Assembly Tilt Angle App 20150116589 - JAN; SHIN-DAR	2015-04-30
Substrate inside type module structure Grant 8,901,693 - Jan December 2, 2	2014-12-02
Chip module structure for particles protection Grant 8,872,296 - Jan October 28, 2	2014-10-28
Holder on chip module structure Grant 8,866,246 - Jan October 21, 2	2014-10-21
Module structure with partial pierced substrate Grant 8,816,414 - Jan August 26, 2	2014-08-26
Substrate connection type module structure Grant 8,809,984 - Jan August 19, 2	2014-08-19
Module Structure with Partial Pierced Substrate App 20140124887 - JAN; Shin-Dar	2014-05-08
Chip Module Structure for Particles Protection App 20140117479 - JAN; Shin-Dar	2014-05-01
Holder On Chip Module Structure App 20140117480 - JAN; Shin-Dar	2014-05-01
Substrate Inside Type Module Structure App 20140035081 - Jan; Shin-Dar	2014-02-06
Window Type Camera Module Structure App 20140035079 - Jan; Shin-Dar	2014-02-06
Pierced Substrate on Chip Module Structure App 20140035165 - Jan; Shin-Dar	2014-02-06
Substrate Connection Type Module Structure App 20140035078 - Jan; Shin-Dar	2014-02-06

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