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Patent applications and USPTO patent grants for Jan; Jia-Shing.The latest application filed is for "method for removing si-needles of wafer".
Patent | Date |
---|---|
Method of spiking mixed acid liquid in reactor Grant 6,852,641 - Ni , et al. February 8, 2 | 2005-02-08 |
Method for removing Si-needles of wafer Grant 6,780,780 - Ni , et al. August 24, 2 | 2004-08-24 |
Method for removing Si-needles of wafer App 20030170997 - Ni, Chih-Jung ;   et al. | 2003-09-11 |
Clean equipment for removing polymer residues on sidewalls of metal lines and method thereof App 20030140948 - Ni, Chih-Jung ;   et al. | 2003-07-31 |
Method of spiking mixed acid liquid in reactor App 20030143860 - Ni, Chih-Jung ;   et al. | 2003-07-31 |
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