Jamieson; Mark P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jamieson; Mark P..The latest application filed is for "high-density flip-chip interconnect".
- Jamieson; Mark P. - Folsom CA
| Patent | Date |
|---|---|
| High-density flip-chip interconnect Grant 8,125,087 - Jamieson February 28, 2 | 2012-02-28 |
| Underside heat slug for ball grid array packages Grant 6,545,351 - Jamieson , et al. April 8, 2 | 2003-04-08 |
| High-density flip-chip interconnect App 20020113307 - Jamieson, Mark P. | 2002-08-22 |
| A method for creating printed circuit board substrates having solder mask-free edges App 20020045294 - Barrett, Joseph C. ; et al. | 2002-04-18 |
| Underside heat slug for ball grid array packages Grant 6,060,777 - Jamieson , et al. May 9, 2 | 2000-05-09 |
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