Patent | Date |
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Inserts for directing molding compound flow and semiconductor die assemblies Grant 8,716,847 - James May 6, 2 | 2014-05-06 |
Inserts For Directing Molding Compound Flow And Semiconductor Die Assemblies App 20130168838 - James; Stephen L. | 2013-07-04 |
Inserts for directing molding compound flow and semiconductor die assemblies Grant 8,399,966 - James March 19, 2 | 2013-03-19 |
Inserts For Directing Molding Compound Flow And Semiconductor Die Assemblies App 20120235286 - James; Stephen L. | 2012-09-20 |
Method and apparatus for directing molding compound flow and resulting semiconductor device packages Grant 8,207,599 - James June 26, 2 | 2012-06-26 |
Method And Apparatus For Directing Molding Compound Flow And Resulting Semiconductor Device Packages App 20110163427 - James; Stephen L. | 2011-07-07 |
Method and apparatus for directing molding compound flow and resulting semiconductor device packages Grant 7,927,923 - James April 19, 2 | 2011-04-19 |
Standoffs for centralizing internals in packaging process Grant 7,501,309 - James , et al. March 10, 2 | 2009-03-10 |
Standoffs for centralizing internals in packaging process Grant 7,462,510 - James , et al. December 9, 2 | 2008-12-09 |
Standoffs for centralizing internals in packaging process Grant 7,459,797 - James , et al. December 2, 2 | 2008-12-02 |
Method and apparatus for directing molding compound flow and resulting semiconductor device packages App 20080073758 - James; Stephen L. | 2008-03-27 |
Standoffs for centralizing internals in packaging process Grant 7,323,767 - James , et al. January 29, 2 | 2008-01-29 |
Leadframe alteration to direct compound flow into package Grant 7,271,036 - James September 18, 2 | 2007-09-18 |
Leadframe alteration to direct compound flow into package Grant 7,271,037 - James September 18, 2 | 2007-09-18 |
Leadframe alteration to direct compound flow into package Grant 7,247,927 - James July 24, 2 | 2007-07-24 |
Standoffs for centralizing internals in packaging process App 20060292750 - James; Stephen L. ;   et al. | 2006-12-28 |
Leadframe alteration to direct compound flow into package App 20060263943 - James; Stephen L. | 2006-11-23 |
Methods and apparatuses for encapsulating microelectronic devices App 20060261498 - James; Stephen L. | 2006-11-23 |
Standoffs for centralizing internals in packaging process App 20060237832 - James; Stephen L. ;   et al. | 2006-10-26 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices App 20060180907 - James; Stephen L. ;   et al. | 2006-08-17 |
Slotted adhesive for die-attach in BOC and LOC packages Grant 7,054,161 - James May 30, 2 | 2006-05-30 |
Leadframe alteration to direct compound flow into package Grant 7,053,467 - James May 30, 2 | 2006-05-30 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Grant 7,049,685 - James , et al. May 23, 2 | 2006-05-23 |
Leadframe alteration to direct compound flow into package App 20050287712 - James, Stephen L. | 2005-12-29 |
Leadframe alteration to direct compound flow into package App 20050285237 - James, Stephen L. | 2005-12-29 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Grant 6,979,595 - James , et al. December 27, 2 | 2005-12-27 |
Standoffs for centralizing internals in packaging process App 20050023562 - James, Stephen L. ;   et al. | 2005-02-03 |
Single sided adhesive tape for compound diversion on BOC substrates Grant 6,815,835 - James November 9, 2 | 2004-11-09 |
Standoffs for centralizing internals in packaging process App 20040169292 - James, Stephen L. ;   et al. | 2004-09-02 |
Gate area relief strip for a molded I/C package Grant 6,734,372 - James , et al. May 11, 2 | 2004-05-11 |
Apparatus and method for reducing interposer compression during molding process Grant 6,690,086 - James , et al. February 10, 2 | 2004-02-10 |
Single sided adhesive tape for compound diversion on BOC substrates App 20040007781 - James, Stephen L. | 2004-01-15 |
Single sided adhesive tape for compound diversion on BOC substrates Grant 6,657,132 - James December 2, 2 | 2003-12-02 |
Standoffs for centralizing internals in packaging process App 20030201525 - James, Stephen L. ;   et al. | 2003-10-30 |
Apparatus and method for reducing interposer compression during molding process App 20030085472 - James, Stephen L. ;   et al. | 2003-05-08 |
Leadframe alteration to direct compound flow into package App 20030017651 - James, Stephen L. | 2003-01-23 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices App 20020175399 - James, Stephen L. ;   et al. | 2002-11-28 |
Gate area relief strip for a molded I/C package App 20020166695 - James, Stephen L. ;   et al. | 2002-11-14 |
Single sided adhesive tape for compound diversion on BOC substrates App 20020129973 - James, Stephen L. | 2002-09-19 |
Apparatus and method for reducing interposer compression during molding process App 20020084538 - James, Stephen L. ;   et al. | 2002-07-04 |
Leadframe alteration to direct compound flow into package App 20010053566 - James, Stephen L. | 2001-12-20 |