James; Stephen L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for James; Stephen L..The latest application filed is for "inserts for directing molding compound flow and semiconductor die assemblies".

Company Profile

0.20.22

James; Stephen L. - Flagstaff AZ
James; Stephen L. - Boise ID
James; Stephen L - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Inserts for directing molding compound flow and semiconductor die assemblies Grant 8,716,847 - James May 6, 2	2014-05-06
Inserts For Directing Molding Compound Flow And Semiconductor Die Assemblies App 20130168838 - James; Stephen L.	2013-07-04
Inserts for directing molding compound flow and semiconductor die assemblies Grant 8,399,966 - James March 19, 2	2013-03-19
Inserts For Directing Molding Compound Flow And Semiconductor Die Assemblies App 20120235286 - James; Stephen L.	2012-09-20
Method and apparatus for directing molding compound flow and resulting semiconductor device packages Grant 8,207,599 - James June 26, 2	2012-06-26
Method And Apparatus For Directing Molding Compound Flow And Resulting Semiconductor Device Packages App 20110163427 - James; Stephen L.	2011-07-07
Method and apparatus for directing molding compound flow and resulting semiconductor device packages Grant 7,927,923 - James April 19, 2	2011-04-19
Standoffs for centralizing internals in packaging process Grant 7,501,309 - James , et al. March 10, 2	2009-03-10
Standoffs for centralizing internals in packaging process Grant 7,462,510 - James , et al. December 9, 2	2008-12-09
Standoffs for centralizing internals in packaging process Grant 7,459,797 - James , et al. December 2, 2	2008-12-02
Method and apparatus for directing molding compound flow and resulting semiconductor device packages App 20080073758 - James; Stephen L.	2008-03-27
Standoffs for centralizing internals in packaging process Grant 7,323,767 - James , et al. January 29, 2	2008-01-29
Leadframe alteration to direct compound flow into package Grant 7,271,036 - James September 18, 2	2007-09-18
Leadframe alteration to direct compound flow into package Grant 7,271,037 - James September 18, 2	2007-09-18
Leadframe alteration to direct compound flow into package Grant 7,247,927 - James July 24, 2	2007-07-24
Standoffs for centralizing internals in packaging process App 20060292750 - James; Stephen L. ; et al.	2006-12-28
Leadframe alteration to direct compound flow into package App 20060263943 - James; Stephen L.	2006-11-23
Methods and apparatuses for encapsulating microelectronic devices App 20060261498 - James; Stephen L.	2006-11-23
Standoffs for centralizing internals in packaging process App 20060237832 - James; Stephen L. ; et al.	2006-10-26
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices App 20060180907 - James; Stephen L. ; et al.	2006-08-17
Slotted adhesive for die-attach in BOC and LOC packages Grant 7,054,161 - James May 30, 2	2006-05-30
Leadframe alteration to direct compound flow into package Grant 7,053,467 - James May 30, 2	2006-05-30
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Grant 7,049,685 - James , et al. May 23, 2	2006-05-23
Leadframe alteration to direct compound flow into package App 20050287712 - James, Stephen L.	2005-12-29
Leadframe alteration to direct compound flow into package App 20050285237 - James, Stephen L.	2005-12-29
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Grant 6,979,595 - James , et al. December 27, 2	2005-12-27
Standoffs for centralizing internals in packaging process App 20050023562 - James, Stephen L. ; et al.	2005-02-03
Single sided adhesive tape for compound diversion on BOC substrates Grant 6,815,835 - James November 9, 2	2004-11-09
Standoffs for centralizing internals in packaging process App 20040169292 - James, Stephen L. ; et al.	2004-09-02
Gate area relief strip for a molded I/C package Grant 6,734,372 - James , et al. May 11, 2	2004-05-11
Apparatus and method for reducing interposer compression during molding process Grant 6,690,086 - James , et al. February 10, 2	2004-02-10
Single sided adhesive tape for compound diversion on BOC substrates App 20040007781 - James, Stephen L.	2004-01-15
Single sided adhesive tape for compound diversion on BOC substrates Grant 6,657,132 - James December 2, 2	2003-12-02
Standoffs for centralizing internals in packaging process App 20030201525 - James, Stephen L. ; et al.	2003-10-30
Apparatus and method for reducing interposer compression during molding process App 20030085472 - James, Stephen L. ; et al.	2003-05-08
Leadframe alteration to direct compound flow into package App 20030017651 - James, Stephen L.	2003-01-23
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices App 20020175399 - James, Stephen L. ; et al.	2002-11-28
Gate area relief strip for a molded I/C package App 20020166695 - James, Stephen L. ; et al.	2002-11-14
Single sided adhesive tape for compound diversion on BOC substrates App 20020129973 - James, Stephen L.	2002-09-19
Apparatus and method for reducing interposer compression during molding process App 20020084538 - James, Stephen L. ; et al.	2002-07-04
Leadframe alteration to direct compound flow into package App 20010053566 - James, Stephen L.	2001-12-20

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