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Patent applications and USPTO patent grants for Jairazbhoy; Vivek Amir.The latest application filed is for "traction battery thermal plate with transverse channel configuration".
Patent | Date |
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Traction battery thermal plate with transverse channel configuration Grant 10,396,411 - Jairazbhoy , et al. A | 2019-08-27 |
Traction battery thermal plate with longitudinal channel configuration Grant 9,452,683 - Jairazbhoy , et al. September 27, 2 | 2016-09-27 |
Traction battery thermal plate with multi pass channel configuration Grant 9,368,845 - Jairazbhoy , et al. June 14, 2 | 2016-06-14 |
Traction Battery Thermal Plate With Longitudinal Channel Configuration App 20150244037 - Jairazbhoy; Vivek Amir ;   et al. | 2015-08-27 |
Traction Battery Thermal Plate With Multi Pass Channel Configuration App 20150244038 - Jairazbhoy; Vivek Amir ;   et al. | 2015-08-27 |
Traction Battery Thermal Plate With Transverse Channel Configuration App 20150244039 - Jairazbhoy; Vivek Amir ;   et al. | 2015-08-27 |
System For Supporting And Electrically Grounding A Cover Of An Electronic Control Module App 20080266820 - Jairazbhoy; Vivek Amir ;   et al. | 2008-10-30 |
Method for attaching a die with a low melting metal Grant 6,826,829 - Pham , et al. December 7, 2 | 2004-12-07 |
Method for attaching a die with a low melting metal App 20030167630 - Pham, Cuong Van ;   et al. | 2003-09-11 |
Void-free die attachment method with low melting metal Grant 6,601,753 - Baker , et al. August 5, 2 | 2003-08-05 |
Void-free die attachment method with low melting metal App 20020170944 - Baker, Jay DeAvis ;   et al. | 2002-11-21 |
Evaporative cooling device and method App 20020144802 - Jairazbhoy, Vivek Amir ;   et al. | 2002-10-10 |
Enhanced mounting pads for printed circuit boards Grant 6,405,920 - Brunner , et al. June 18, 2 | 2002-06-18 |
Method and apparatus for dispensing viscous material Grant 6,395,087 - Jairazbhoy , et al. May 28, 2 | 2002-05-28 |
Method for making an electronic circuit assembly Grant 6,381,837 - Baker , et al. May 7, 2 | 2002-05-07 |
Circuit board and a method for making the same App 20020020552 - Belke, Robert Edward ;   et al. | 2002-02-21 |
Method for making an electronic circuit assembly App 20020000331 - Jairazbhoy, Vivek Amir ;   et al. | 2002-01-03 |
Anti-bridging solder ball collection zones Grant 6,316,736 - Jairazbhoy , et al. November 13, 2 | 2001-11-13 |
Interposer for mounting semiconductor dice on substrates Grant 6,303,992 - Van Pham , et al. October 16, 2 | 2001-10-16 |
Solder resist window configurations for solder paste overprinting Grant 6,169,253 - Jairazbhoy , et al. January 2, 2 | 2001-01-02 |
Enhanced mounting pads for printed circuit boards Grant 6,115,262 - Brunner , et al. September 5, 2 | 2000-09-05 |
Substrate with embedded member for improving solder joint strength Grant 6,049,466 - Jairazbhoy April 11, 2 | 2000-04-11 |
Method for cooling electronic components Grant 5,986,884 - Jairazbhoy , et al. November 16, 1 | 1999-11-16 |
Standoff controlled interconnection Grant 5,931,371 - Pao , et al. August 3, 1 | 1999-08-03 |
Reflow soldering to mounting pads with vent channels to avoid skewing Grant 5,842,275 - McMillan, II , et al. December 1, 1 | 1998-12-01 |
Molten solder dispensing system Grant 5,746,368 - Straub , et al. May 5, 1 | 1998-05-05 |
Apparatus for storing and cooling electronic devices and/or modules in a vehicle Grant 5,669,813 - Jairazbhoy , et al. September 23, 1 | 1997-09-23 |
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