loadpatents
name:-0.0078318119049072
name:-0.021489143371582
name:-0.003842830657959
Jairath; Rahul Patent Filings

Jairath; Rahul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jairath; Rahul.The latest application filed is for "data platform and analytics for predicting media metrics".

Company Profile
2.17.5
  • Jairath; Rahul - New Delhi IN
  • Jairath, Rahul - San Jose CA
  • Jairath; Rahul - Austin TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Data platform and analytics for predicting media metrics
Grant 10,762,524 - Poynter , et al. Sep
2020-09-01
Data Platform And Analytics For Predicting Media Metrics
App 20200034873 - Poynter; Nicola Sarah Vanessa ;   et al.
2020-01-30
Integrated pad and belt for chemical mechanical polishing
App 20050118936 - Pant, Anil K. ;   et al.
2005-06-02
Plating method and apparatus using contactless electrode
Grant 6,855,239 - Jairath February 15, 2
2005-02-15
Integrated pad and belt for chemical mechanical polishing
Grant 6,656,025 - Pant , et al. December 2, 2
2003-12-02
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
Grant 6,621,584 - Pecen , et al. September 16, 2
2003-09-16
Method of transporting a semiconductor wafer in a wafer polishing system
Grant 6,517,418 - Engdahl , et al. February 11, 2
2003-02-11
Method and apparatus for in-situ monitoring of thickness during chemical -mechanical polishing
App 20020089676 - Pecen, Jiri ;   et al.
2002-07-11
System and method for creating and navigating a linear hypermedia resource program
App 20020031988 - Pant, Anil K. ;   et al.
2002-03-14
Integrated pad and belt for chemical mechanical polishing
Grant 6,328,642 - Pant , et al. December 11, 2
2001-12-11
Method of transporting a semiconductor wafer in a wafer polishing system
App 20010039168 - Engdahl, Erik H. ;   et al.
2001-11-08
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
Grant 6,261,155 - Jairath , et al. July 17, 2
2001-07-17
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
Grant 6,146,248 - Jairath , et al. November 14, 2
2000-11-14
Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
Grant 6,111,634 - Pecen , et al. August 29, 2
2000-08-29
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
Grant 6,108,091 - Pecen , et al. August 22, 2
2000-08-22
Method for dressing a polishing pad during polishing of a semiconductor wafer
Grant 5,913,714 - Volodarsky , et al. June 22, 1
1999-06-22
Slurry formulation for chemical mechanical polishing of metals
Grant 5,866,031 - Carpio , et al. February 2, 1
1999-02-02
Wafer polishing head with pad dressing element
Grant 5,857,899 - Volodarsky , et al. January 12, 1
1999-01-12
Sensors for a linear polisher
Grant 5,762,536 - Pant , et al. June 9, 1
1998-06-09
Method and apparatus for polishing a semiconductor substrate wafer
Grant 5,688,360 - Jairath November 18, 1
1997-11-18
Method of using additives with silica-based slurries to enhance selectivity in metal CMP
Grant 5,614,444 - Farkas , et al. March 25, 1
1997-03-25
Point of use slurry dispensing system
Grant 5,478,435 - Murphy , et al. December 26, 1
1995-12-26

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