Patent | Date |
---|
Data platform and analytics for predicting media metrics Grant 10,762,524 - Poynter , et al. Sep | 2020-09-01 |
Data Platform And Analytics For Predicting Media Metrics App 20200034873 - Poynter; Nicola Sarah Vanessa ;   et al. | 2020-01-30 |
Integrated pad and belt for chemical mechanical polishing App 20050118936 - Pant, Anil K. ;   et al. | 2005-06-02 |
Plating method and apparatus using contactless electrode Grant 6,855,239 - Jairath February 15, 2 | 2005-02-15 |
Integrated pad and belt for chemical mechanical polishing Grant 6,656,025 - Pant , et al. December 2, 2 | 2003-12-02 |
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing Grant 6,621,584 - Pecen , et al. September 16, 2 | 2003-09-16 |
Method of transporting a semiconductor wafer in a wafer polishing system Grant 6,517,418 - Engdahl , et al. February 11, 2 | 2003-02-11 |
Method and apparatus for in-situ monitoring of thickness during chemical -mechanical polishing App 20020089676 - Pecen, Jiri ;   et al. | 2002-07-11 |
System and method for creating and navigating a linear hypermedia resource program App 20020031988 - Pant, Anil K. ;   et al. | 2002-03-14 |
Integrated pad and belt for chemical mechanical polishing Grant 6,328,642 - Pant , et al. December 11, 2 | 2001-12-11 |
Method of transporting a semiconductor wafer in a wafer polishing system App 20010039168 - Engdahl, Erik H. ;   et al. | 2001-11-08 |
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Grant 6,261,155 - Jairath , et al. July 17, 2 | 2001-07-17 |
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Grant 6,146,248 - Jairath , et al. November 14, 2 | 2000-11-14 |
Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing Grant 6,111,634 - Pecen , et al. August 29, 2 | 2000-08-29 |
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing Grant 6,108,091 - Pecen , et al. August 22, 2 | 2000-08-22 |
Method for dressing a polishing pad during polishing of a semiconductor wafer Grant 5,913,714 - Volodarsky , et al. June 22, 1 | 1999-06-22 |
Slurry formulation for chemical mechanical polishing of metals Grant 5,866,031 - Carpio , et al. February 2, 1 | 1999-02-02 |
Wafer polishing head with pad dressing element Grant 5,857,899 - Volodarsky , et al. January 12, 1 | 1999-01-12 |
Sensors for a linear polisher Grant 5,762,536 - Pant , et al. June 9, 1 | 1998-06-09 |
Method and apparatus for polishing a semiconductor substrate wafer Grant 5,688,360 - Jairath November 18, 1 | 1997-11-18 |
Method of using additives with silica-based slurries to enhance selectivity in metal CMP Grant 5,614,444 - Farkas , et al. March 25, 1 | 1997-03-25 |
Point of use slurry dispensing system Grant 5,478,435 - Murphy , et al. December 26, 1 | 1995-12-26 |