Jain; Syadwad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jain; Syadwad.The latest application filed is for "heat spreader edge standoffs for managing bondline thickness in microelectronic packages".

Company Profile

7.9.15

Jain; Syadwad - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat Spreader Edge Standoffs For Managing Bondline Thickness In Microelectronic Packages App 20210305118 - Thanu; Dinesh P. R. ; et al.	2021-09-30
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages Grant 11,062,970 - Thanu , et al. July 13, 2	2021-07-13
Heat spreaders with interlocked inserts Grant 10,969,840 - Antoniswamy , et al. April 6, 2	2021-04-06
Integrated heat spreader having electromagnetically-formed features Grant 10,763,188 - Antoniswamy , et al. Sep	2020-09-01
Foam composite Grant 10,651,108 - Tang , et al.	2020-05-12
Multiple-chip package with multiple thermal interface materials Grant 10,580,717 - Liu , et al.	2020-03-03
Heat Spreaders With Interlocked Inserts App 20190079567 - Antoniswamy; Aravindha R. ; et al.	2019-03-14
Heat Spreader Edge Standoffs For Managing Bondline Thickness In Microelectronic Packages App 20190067153 - Thanu; Dinesh P. R. ; et al.	2019-02-28
Sintered Heat Spreaders With Inserts App 20190027379 - Hu; Wei ; et al.	2019-01-24
Multiple-chip Package With Multiple Thermal Interface Materials App 20180374776 - LIU; Boxi ; et al.	2018-12-27
Adhesive Polymer Thermal Interface Material With Sintered Fillers For Thermal Conductivity In Micro-electronic Packaging App 20180323130 - LIU; Boxi ; et al.	2018-11-08
Polymer thermal interface material having enhanced thermal conductivity Grant 10,056,314 - Lowe, Jr. , et al. August 21, 2	2018-08-21
Foam Composite App 20180005917 - Tang; Zhizhong ; et al.	2018-01-04
Integrated heat spreader having electromagnetically-formed features App 20170186628 - Antoniswamy; Aravindha R. ; et al.	2017-06-29
Polymer thermal interface material having enhanced thermal conductivity Grant 9,070,660 - Lowe, Jr. , et al. June 30, 2	2015-06-30
Paste thermal interface materials Grant 8,896,110 - Hu , et al. November 25, 2	2014-11-25
Molded heat spreaders Grant 8,866,290 - Tang , et al. October 21, 2	2014-10-21
Molded Heat Spreaders App 20140264821 - Tang; Zhizhong ; et al.	2014-09-18
Polymer Thermal Interface Material Having Enhanced Thermal Conductivity App 20140264818 - Lowe, JR.; Randall D. ; et al.	2014-09-18
Paste Thermal Interface Materials App 20140264820 - Hu; Wei ; et al.	2014-09-18

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