Jain; Padam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jain; Padam.The latest application filed is for "methods and heat distribution devices for thermal management of chip assemblies".

Company Profile

2.3.9

Jain; Padam - San Jose CA
Jain; Padam - Castro Valley CA
Jain; Padam - Davis CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies App 20210378106 - Iyengar; Madhusudan K. ; et al.	2021-12-02
Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules App 20210366841 - Iyengar; Madhusudan K. ; et al.	2021-11-25
Direct Liquid Cooling With O-Ring Sealing App 20210366807 - Padilla; Jorge ; et al.	2021-11-25
Spring Loaded Compliant Coolant Distribution Manifold for Direct Liquid Cooled Modules App 20210366806 - Iyengar; Madhusudan K. ; et al.	2021-11-25
Device and method for direct liquid cooling via metal channels Grant 10,964,625 - Jain , et al. March 30, 2	2021-03-30
Device And Method For Direct Liquid Cooling Via Metal Channels App 20200273777 - Jain; Padam ; et al.	2020-08-27
Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards Grant 9,832,865 - Ajoian , et al. November 28, 2	2017-11-28
Methods And Devices For Providing Increased Routing Flexibility In Multi-layer Printed Circuit Boards App 20170311444 - Ajoian; Jack ; et al.	2017-10-26
Multilayer substrate for semiconductor packaging Grant 9,788,416 - Jen , et al. October 10, 2	2017-10-10
Printed Circuit Board With Compartmental Shields For Electronic Components And Methods Of Fabricating The Same App 20170223839 - Jain; Padam ; et al.	2017-08-03
Coreless Substrate Having Primer Layers Adjacent To Bottom And Top Outer Metal Layers App 20170215278 - Jain; Padam ; et al.	2017-07-27
Multilayer Substrate For Semiconductor Packaging App 20160329274 - Jen; Wei-Lun Kane ; et al.	2016-11-10

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