JAILLET; Romain
Patent Applications and Registrations
Patent applications and USPTO patent grants for JAILLET; Romain.The latest application filed is for "electronic chip package having a support and a conductive layer on the support".
- JAILLET; Romain - Tours FR
| Patent | Date |
|---|---|
| Electronic Chip Package Having A Support And A Conductive Layer On The Support App 20220020652 - ORY; Olivier ; et al. | 2022-01-20 |
| Electronic chip package having a support and a conductive layer on the support Grant 11,158,556 - Ory , et al. October 26, 2 | 2021-10-26 |
| Electronic Chip Package App 20200075445 - ORY; Olivier ; et al. | 2020-03-05 |
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