Jaffe; Mark David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jaffe; Mark David.The latest application filed is for "transistor using selective undercut at gate conductor and gate insulator corner".
- Jaffe; Mark David - Shelburne VT
| Patent | Date |
|---|---|
| Transistor Using Selective Undercut At Gate Conductor And Gate Insulator Corner App 20180204926 - Abou-Khalil; Michel J. ; et al. | 2018-07-19 |
| SOI-MOSFET gate insulation layer with different thickness Grant 9,978,849 - Abou-Khalil , et al. May 22, 2 | 2018-05-22 |
| Transistor Using Selective Undercut At Gate Conductor And Gate Insulator Corner App 20170186845 - Abou-Khalil; Michel J. ; et al. | 2017-06-29 |
| Double-sided integrated circuit chips Grant 8,471,306 - Bernstein , et al. June 25, 2 | 2013-06-25 |
| Double-sided integrated circuit chips Grant 8,421,126 - Bernstein , et al. April 16, 2 | 2013-04-16 |
| Structures, design structures and methods of fabricating global shutter pixel sensor cells Grant 8,138,531 - Adkisson , et al. March 20, 2 | 2012-03-20 |
| Double-sided Integrated Circuit Chips App 20110302542 - Bernstein; Kerry ; et al. | 2011-12-08 |
| Double-sided Integrated Circuit Chips App 20110241082 - Bernstein; Kerry ; et al. | 2011-10-06 |
| Double-sided integrated circuit chips Grant 8,013,342 - Bernstein , et al. September 6, 2 | 2011-09-06 |
| Wafer-to-wafer alignments Grant 8,004,289 - Dalton , et al. August 23, 2 | 2011-08-23 |
| Double-sided integrated circuit chips Grant 7,989,312 - Bernstein , et al. August 2, 2 | 2011-08-02 |
| Dual wired integrated circuit chips Grant 7,960,245 - Bernstein , et al. June 14, 2 | 2011-06-14 |
| Dual wired integrated circuit chips Grant 7,939,914 - Bernstein , et al. May 10, 2 | 2011-05-10 |
| Structures, Design Structures And Methods Of Fabricating Global Shutter Pixel Sensor Cells App 20110062542 - Adkisson; James William ; et al. | 2011-03-17 |
| Dual-sided chip attached modules Grant 7,863,734 - Bernstein , et al. January 4, 2 | 2011-01-04 |
| Double-sided integrated circuit chips Grant 7,670,927 - Bernstein , et al. March 2, 2 | 2010-03-02 |
| Double-sided Integrated Circuit Chips App 20100044759 - Bernstein; Kerry ; et al. | 2010-02-25 |
| Dual Wired Integrated Circuit Chips App 20090121287 - Bernstein; Kerry ; et al. | 2009-05-14 |
| Double-sided Integrated Circuit Chips App 20090121260 - Bernstein; Kerry ; et al. | 2009-05-14 |
| Dual-sided Chip Attached Modules App 20090065925 - Bernstein; Kerry ; et al. | 2009-03-12 |
| CMOS sensors having charge pushing regions Grant 7,492,048 - Adkisson , et al. February 17, 2 | 2009-02-17 |
| Wafer-to-wafer Alignments App 20080308948 - Dalton; Thomas Joseph ; et al. | 2008-12-18 |
| Dual-sided chip attached modules Grant 7,462,509 - Bernstein , et al. December 9, 2 | 2008-12-09 |
| Dual Wired Integrated Circuit Chips App 20080213948 - Bernstein; Kerry ; et al. | 2008-09-04 |
| Dual Wired Integrated Circuit Chips App 20080128812 - Bernstein; Kerry ; et al. | 2008-06-05 |
| Dual wired integrated circuit chips Grant 7,381,627 - Bernstein , et al. June 3, 2 | 2008-06-03 |
| Dual Wired Integrated Circuit Chips App 20070267698 - Bernstein; Kerry ; et al. | 2007-11-22 |
| Dual-sided Chip Attached Modules App 20070267746 - Bernstein; Kerry ; et al. | 2007-11-22 |
| Double-sided Integrated Circuit Chips App 20070267723 - Bernstein; Kerry ; et al. | 2007-11-22 |
| Dual wired integrated circuit chips Grant 7,285,477 - Bernstein , et al. October 23, 2 | 2007-10-23 |
| Cmos Sensors Having Charge Pushing Regions App 20070158711 - Adkisson; James William ; et al. | 2007-07-12 |
| Wafer-to-wafer Alignments App 20070132067 - Dalton; Timothy Joseph ; et al. | 2007-06-14 |
| Wafer-to-wafer alignments Grant 7,193,423 - Dalton , et al. March 20, 2 | 2007-03-20 |
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